P

Inventor

NEQUIST ERIC M

US7 patents
⚠️ This page may combine multiple inventors who share the name “NEQUIST ERIC M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XCELSIS CORP

4 patents
US10672663B2Jun 2, 2020

3D chip sharing power circuit

XCELSIS CORP25 citations94
US10586786B2Mar 10, 2020

3D chip sharing clock interconnect layer

XCELSIS CORP22 citations94
US10580757B2Mar 3, 2020

Face-to-face mounted IC dies with orthogonal top interconnect layers

XCELSIS CORP25 citations93
US10892252B2Jan 12, 2021

Face-to-face mounted IC dies with orthogonal top interconnect layers

XCELSIS CORP0 citations62

ADEIA SEMICONDUCTOR INC

2 patents
US11557516B2Jan 17, 2023

3D chip with shared clock distribution network

ADEIA SEMICONDUCTOR INC7 citations85
US12142528B2Nov 12, 2024

3D chip with shared clock distribution network

ADEIA SEMICONDUCTOR INC2 citations72

BRASHEARS RICHARD VAUGHN

1 patent
US8717182B1May 6, 2014

Mechanism and method to implement a reader mechanism for a container-based monitor of a consumable product

BRASHEARS RICHARD VAUGHN43 citations84