Inventor

BAE HYUNIL

KR4 patents

⚠️ This page may combine multiple inventors who share the name “BAE HYUNIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAE HYUNIL

2 patents

US9559046B2Jan 31, 2017

Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias

BAE HYUNIL4 citations62

US8816487B2Aug 26, 2014

Integrated circuit packaging system with package-in-package and method of manufacture thereof

BAE HYUNIL2 citations56

STATS CHIPPAC PTE LTD

1 patent

US12424595B2Sep 23, 2025

Semiconductor device and method of forming package with double-sided integrated passive device

STATS CHIPPAC PTE LTD0 citations58

KIM JINGWAN

1 patent

US8476135B2Jul 2, 2013

Integrated circuit packaging system with vertical interconnects and method of manufacture thereof

KIM JINGWAN1 citations46