Inventor

CHO SUNGWON

KR65 patents

⚠️ This page may combine multiple inventors who share the name “CHO SUNGWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHO SUNGWON

STATS CHIPPAC PTE LTD

Shielded semiconductor packages with open terminals and methods of making via two-step process

Semiconductor device with partial EMI shielding removal using laser ablation

Semiconductor device with partial EMI shielding and method of making the same

EMI shielding for flip chip package with exposed die backside

Integrated circuit packaging system with shielding and method of manufacturing thereof

Shielded semiconductor package with open terminal and methods of making

Semiconductor device and method of forming magnetic field shielding with ferromagnetic material

EMI shielding for flip chip package with exposed die backside

Semiconductor device with partial EMI shielding removal using laser ablation

Shielded semiconductor package with open terminal and methods of making

Semiconductor device with partial EMI shielding removal using laser ablation

EMI shielding for flip chip package with exposed die backside

Shielded semiconductor package with open terminal and methods of making

Semiconductor device with partial EMI shielding and method of making the same

Semiconductor device with partial EMI shielding removal using laser ablation

Shielded semiconductor packages with open terminals and methods of making via two-step process

EMI shielding for flip chip package with exposed die backside

Integrated circuit packaging system with shielding and method of manufacture thereof

Integrated circuit packaging system with shielding and method of manufacture thereof

Emi shielding for flip chip package with exposed die backside

SAMSUNG DISPLAY CO LTD

Display panel with color control layer including wall bases having reflective layers on sidewalls thereof

Display device and method of fabricating the same

Electronic apparatus and method for manufacturing the same

Display apparatus and method of manufacturing the same

Method of manufacturing display panel with color control layer including wall bases having reflective layers on sidewalls thereof

Display device and method of manufacturing the same

Display substrate, method of manufacturing the same, and display device including the same

Display substrate, method of manufacturing the same, and display device including the same

Input detection unit and electronic device including same

Display device and a method of manufacturing the same

CHO SUNGWON

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump

Semiconductor device and method of forming column interconnect structure to reduce wafer stress

Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

SAMSUNG ELECTRONICS CO LTD

Apparatus and method for predicting potential change of coronary artery calcification (CAC) level

Method and apparatus for processing audio signal

Vertical semiconductor devices

Plasma sensor module

CHOI DAESIK

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

KIM OHHAN

Semiconductor device and method of forming WLCSP structure using protruded MLP

Semiconductor device and method of forming WLCSP structure using protruded MLP

STATS CHIPPAC LTD

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

COUPANG CORP

Computerized systems and methods for managing inventory by grading returned products

Computerized systems and methods for managing inventory by grading returned products

CHOI JOONYOUNG

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

PARK HYUNG SANG

Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage