Inventor
LIU FANG CHANG
TW17 patents
⚠️ This page may combine multiple inventors who share the name “LIU FANG CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EFFICIENT POWER CONVERSION CORP
8 patentsUS9837438B2Dec 5, 2017
GaN transistors with polysilicon layers used for creating additional components
EFFICIENT POWER CONVERSION CORP6 citations83
US9214461B2Dec 15, 2015
GaN transistors with polysilicon layers for creating additional components
EFFICIENT POWER CONVERSION CORP9 citations82
US10312260B2Jun 4, 2019
GaN transistors with polysilicon layers used for creating additional components
EFFICIENT POWER CONVERSION CORP3 citations72
US9171911B2Oct 27, 2015
Isolation structure in gallium nitride devices and integrated circuits
EFFICIENT POWER CONVERSION CORP6 citations72
US9214399B2Dec 15, 2015
Integrated circuit with matching threshold voltages and method for making same
EFFICIENT POWER CONVERSION CORP1 citations51
US9331191B2May 3, 2016
GaN device with reduced output capacitance and process for making same
EFFICIENT POWER CONVERSION CORP1 citations50
US11101349B2Aug 24, 2021
Lateral power device with reduced on-resistance
EFFICIENT POWER CONVERSION CORP0 citations49
US9214528B2Dec 15, 2015
Method to fabricate self-aligned isolation in gallium nitride devices and integrated circuits
EFFICIENT POWER CONVERSION CORP0 citations40
VISERA TECHNOLOGIES CO LTD
6 patentsUS7569409B2Aug 4, 2009
Isolation structures for CMOS image sensor chip scale packages
VISERA TECHNOLOGIES CO LTD36 citations91
US8361898B2Jan 29, 2013
Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof
VISERA TECHNOLOGIES CO LTD10 citations82
US7566944B2Jul 28, 2009
Package structure for optoelectronic device and fabrication method thereof
VISERA TECHNOLOGIES CO LTD13 citations82
US7679187B2Mar 16, 2010
Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof
VISERA TECHNOLOGIES CO LTD5 citations72
US7833810B2Nov 16, 2010
Method of fabricating isolation structures for CMOS image sensor chip scale packages
VISERA TECHNOLOGIES CO LTD3 citations61
US7824964B2Nov 2, 2010
Method for fabricating package structures for optoelectronic devices
VISERA TECHNOLOGIES CO LTD0 citations50