Inventor
BOYAPATI SRI RANGA SAI SAI
US5 patents
Patents
5 patentsUS11069620B2Jul 20, 2021
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
INTEL CORP6 citations82
US10978399B2Apr 13, 2021
Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate
INTEL CORP2 citations71
US12300613B2May 13, 2025
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
INTEL CORP0 citations61
US11901296B2Feb 13, 2024
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
INTEL CORP0 citations61
US11784128B2Oct 10, 2023
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
INTEL CORP0 citations61