Inventor
PARK YONG
KR69 patents
⚠️ This page may combine multiple inventors who share the name “PARK YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
40 patentsUS11170936B2Nov 9, 2021
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH9 citations86
US10991512B2Apr 27, 2021
Capacitor component
SAMSUNG ELECTRO MECH7 citations84
US10916377B2Feb 9, 2021
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations84
US10679790B2Jun 9, 2020
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations84
US10614955B2Apr 7, 2020
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH6 citations84
US11657976B2May 23, 2023
Capacitor component including reinforcing pattern in a margin/cover portion
SAMSUNG ELECTRO MECH2 citations73
US11610739B2Mar 21, 2023
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US11551875B2Jan 10, 2023
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations73
US11348730B2May 31, 2022
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US11342117B2May 24, 2022
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US11302476B2Apr 12, 2022
Capacitor component having connection portions which include metal and ceramic layers
SAMSUNG ELECTRO MECH4 citations73
US11250992B2Feb 15, 2022
Capacitor component
SAMSUNG ELECTRO MECH2 citations73
US11177072B2Nov 16, 2021
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH3 citations73
US11024460B2Jun 1, 2021
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations73
US10930440B2Feb 23, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations73
US10896781B2Jan 19, 2021
Ceramic capacitor having metal or metal oxide in side margin portions, and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations73
US10699848B2Jun 30, 2020
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations73
US10658114B2May 19, 2020
Ceramic capacitor having metal oxide in side margin portions, and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations73
US10650969B2May 12, 2020
Ceramic capacitor having metal or metal oxide in side margin portions, and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US10553359B1Feb 4, 2020
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US10510490B1Dec 17, 2019
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH3 citations73
US10504653B1Dec 10, 2019
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH2 citations71
US10347427B2Jul 9, 2019
Multilayer ceramic electronic component including external electrodes having extended band portions on one surface of body of multilayer ceramic electronic component
SAMSUNG ELECTRO MECH3 citations71
US11784007B2Oct 10, 2023
Capacitor component including reinforcing pattern in a margin/cover portion
SAMSUNG ELECTRO MECH0 citations63
US11626254B2Apr 11, 2023
Capacitor component
SAMSUNG ELECTRO MECH0 citations63
US11551866B2Jan 10, 2023
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations63
US11495407B2Nov 8, 2022
Capacitor component
SAMSUNG ELECTRO MECH0 citations63
US11335503B2May 17, 2022
Ceramic capacitor having metal or metal oxide in side margin portions, and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations63
US11961682B2Apr 16, 2024
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11923149B2Mar 5, 2024
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations62
US11875945B2Jan 16, 2024
Capacitor component including connection portion between external electrode and body
SAMSUNG ELECTRO MECH0 citations62
US11869723B2Jan 9, 2024
Multilayered capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11694847B2Jul 4, 2023
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11682528B2Jun 20, 2023
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11670459B2Jun 6, 2023
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11610734B2Mar 21, 2023
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations62
US11495410B2Nov 8, 2022
Multilayered capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11387042B2Jul 12, 2022
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations62
US11309132B2Apr 19, 2022
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11587732B2Feb 21, 2023
Multilayer ceramic capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations61
LG SEMICON CO LTD
5 patentsUS5981309ANov 9, 1999
Method for fabricating charge coupled device image sensor
LG SEMICON CO LTD9 citations73
US6107124AAug 22, 2000
Charge coupled device and method of fabricating the same
LG SEMICON CO LTD2 citations63
US6043523AMar 28, 2000
Charge coupled device and method of fabricating the same
LG SEMICON CO LTD2 citations63
US5932915AAug 3, 1999
Electro static discharge protecting circuit with an inner circuit protection mechanism
LG SEMICON CO LTD3 citations63
US6366322B1Apr 2, 2002
Horizontal charge coupled device of CCD image sensor
LG SEMICON CO LTD5 citations62
SAMSUNG ELECTRONICS CO LTD
3 patentsUS6278160B1Aug 21, 2001
Semiconductor device having a reliably-formed narrow active region
SAMSUNG ELECTRONICS CO LTD18 citations93
US5936296AAug 10, 1999
Integrated circuits having metallic fuse links
SAMSUNG ELECTRONICS CO LTD49 citations93
US6569743B2May 27, 2003
Method of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations63
DEERE & CO
1 patentUNIV KOREA RES & BUS FOUND
1 patentShowing the top 50 of 69 patents by PatentIndex Score.