Inventor
MARTINSCHITZ KLAUS
AT2 patents
Patents
2 patentsUS10163681B2Dec 25, 2018
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
MARTINSCHITZ KLAUS3 citations66
US9067363B2Jun 30, 2015
Method and device for permanent bonding of wafers, as well as cutting tool
MARTINSCHITZ KLAUS6 citations66