Inventor

LEE TECK KHENG

SG68 patents

⚠️ This page may combine multiple inventors who share the name “LEE TECK KHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE TECK KHENG

MICRON TECHNOLOGY INC

Apparatus for package reduction in stacked chip and board assemblies

Flip chip packaging using recessed interposer terminals

Elimination of RDL using tape base flip chip on flex for die stacking

Flip chip packaging using recessed interposer terminals

Elimination of RDL using tape base flip chip on flex for die stacking

Semiconductor die packages with recessed interconnecting structures and methods for assembling the same

Method and apparatus for dielectric filling of flip chip on interposer assembly

Apparatus for package reduction in stacked chip and board assemblies

Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same

Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture

BOC BGA package for die with I-shaped bond pad layout

Packaged microelectronic devices with a lead frame

BOC BGA package for die with I-shaped bond pad layout

Methods of fluxless micro-piercing of solder balls, and resulting devices

Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods

Methods of fluxless micro-piercing of solder balls, and resulting devices

Method of fabricating microelectronic devices

Interposers with flexible solder pad elements

Methods for assembly and packaging of flip chip configured dice with interposer

Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods

Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice

Interposer with flexible solder pad elements and methods of manufacturing the same

Methods for assembly and packaging of flip chip configured dice with interposer

Microelectronic devices including underfill apertures

Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same

Apparatus for flip-chip packaging providing testing capability

Semiconductor die packages with recessed interconnecting structures

Intrinsic thermal enhancement for FBGA package

Method for package reduction in stacked chip and board assemblies

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Methods of fluxless micro-piercing of solder balls, and resulting devices

Partitioned through-layer via and associated systems and methods

Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer

Methods for assembly and packaging of flip chip configured dice with interposer

Methods of manufacturing interposers with flexible solder pad elements

Double bumping of flexible substrate for first and second level interconnects

Ultrathin leadframe BGA circuit package

Intrinsic thermal enhancement for FBGA package

Intrinsic thermal enhancement for FBGA package

Ultrathin leadframe BGA circuit package

Microelectronic devices and methods for manufacturing microelectronic devices

Partitioned through-layer via and associated systems and methods

Method of manufacturing an interposer including at least one passive element at least partially defined by a recess therein

LEE TECK KHENG

Elimination of RDL using tape base flip chip on flex for die stacking

Elimination of RDL using tape base flip chip on flex for die stacking

Semiconductor device assemblies

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices

Microelectronic devices and methods for manufacturing microelectronic devices