Inventor
HONG JONGPA
KR4 patents
Patents
4 patentsUS11158594B2Oct 26, 2021
Semiconductor packages having improved reliability in bonds between connection conductors and pads
SAMSUNG ELECTRONICS CO LTD2 citations71
US12074142B2Aug 27, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations69
US11842982B2Dec 12, 2023
Semiconductor package with curing layer between semiconductor chips
SAMSUNG ELECTRONICS CO LTD3 citations69
US11676925B2Jun 13, 2023
Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60