Inventor
KIM SUNMI
KR19 patents
⚠️ This page may combine multiple inventors who share the name “KIM SUNMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAKEDA PHARMACEUTICALS CO
4 patentsUS11649206B2May 16, 2023
Method for producing pyrrole compound
TAKEDA PHARMACEUTICALS CO1 citations68
US11066362B2Jul 20, 2021
Method for producing pyrrole compound
TAKEDA PHARMACEUTICALS CO1 citations68
US10570091B2Feb 25, 2020
Method for producing pyrrole compound
TAKEDA PHARMACEUTICALS CO1 citations68
US12202797B2Jan 21, 2025
Method for producing pyrrole compound
TAKEDA PHARMACEUTICALS CO0 citations58
KIM OHHAN
3 patentsUS8264059B2Sep 11, 2012
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
KIM OHHAN4 citations73
US9293349B2Mar 22, 2016
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
KIM OHHAN1 citations62
US8137995B2Mar 20, 2012
Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures
KIM OHHAN0 citations38
SEMES CO LTD
3 patentsUS11529655B2Dec 20, 2022
Nozzle, substrate processing apparatus including the same, and substrate processing method
SEMES CO LTD3 citations69
US11897005B2Feb 13, 2024
Nozzle, substrate processing apparatus including the same, and substrate processing method
SEMES CO LTD1 citations58
US12557204B2Feb 17, 2026
Nozzle and substrate treating apparatus including the same
SEMES CO LTD0 citations51
STATS CHIPPAC LTD
2 patentsUS7906371B2Mar 15, 2011
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
STATS CHIPPAC LTD64 citations97
US9543258B2Jan 10, 2017
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
STATS CHIPPAC LTD2 citations73