Inventor

SONG YOUNG KYU

US53 patents

⚠️ This page may combine multiple inventors who share the name “SONG YOUNG KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONG YOUNG KYU

QUALCOMM INC

Power distribution improvement using pseudo-ESR control of an embedded passive capacitor

Package on package (PoP) integrated device comprising a capacitor in a substrate

High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)

Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages

Flip-chip employing integrated cavity filter, and related components, systems, and methods

Flip-chip employing integrated cavity filter, and related components, systems, and methods

Integrated circuit package comprising surface capacitor and ground plane

Known good die testing for high frequency applications

Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate

Package substrate comprising capacitor, redistribution layer and discrete coaxial connection

Embedded multi-terminal capacitor

Package on package (PoP) device comprising a high performance inter package connection

Embedded package substrate capacitor

Semiconductor package interconnections and method of making the same

Stiffener with embedded passive components

Inductor structure in a semiconductor device

Integrated device package comprising a real time tunable inductor implemented in a package substrate

Integrated device comprising coaxial interconnect

Embedded sheet capacitor

Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)

Integrated device package comprising a tunable inductor

Patterned grounds and methods of forming the same

Semiconductor package on package structure and method of forming the same

Substrate comprising embedded elongated capacitor

Solenoid inductor in a substrate

Multi-layer ground shield structure of interconnected elements

Multi-layer interconnected spiral capacitor

Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer

Embedded sheet capacitor

Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal

Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield

High quality factor filter implemented in wafer level packaging (WLP) integrated device

Integrated passive device (IPD) on substrate

Toroid inductor in an integrated device

Pattern between pattern for low profile substrate

Inductor design on floating UBM balls for wafer level package (WLP)

Monolithic integration of antenna switch and diplexer

Capacitor structure for power delivery applications

Low profile reinforced package-on-package semiconductor device

Bandpass filter implementation on a single layer using spiral capacitors

BOEING CO

Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance

Variable radio frequency attenuator

Fire suppressing device

Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance

High impedance surface (HIS) enhanced by discrete passives

Electrical module assembly with embedded dies

Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicle

Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives

MICROBONDS INC

Wire bonder for ball bonding insulated wire and method of using same

Wire bonder for ball bonding insulated wire and method of using same