Inventor

HWANG KYU-PYUNG

US38 patents

⚠️ This page may combine multiple inventors who share the name “HWANG KYU-PYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HWANG KYU-PYUNG

QUALCOMM INC

Power distribution improvement using pseudo-ESR control of an embedded passive capacitor

Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages

Integrated circuit package comprising surface capacitor and ground plane

Known good die testing for high frequency applications

Package substrate comprising capacitor, redistribution layer and discrete coaxial connection

Embedded multi-terminal capacitor

Interposer for a package-on-package structure

Package on package (PoP) device comprising a high performance inter package connection

Embedded package substrate capacitor

Semiconductor package interconnections and method of making the same

Stiffener with embedded passive components

Integrated device comprising coaxial interconnect

Embedded sheet capacitor

Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)

Semiconductor package on package structure and method of forming the same

Substrate comprising embedded elongated capacitor

Integrated device package and/or system comprising configurable directional optical transmitter

Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer

Embedded sheet capacitor

Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal

Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield

Pattern between pattern for low profile substrate

Adjustable magnetic probe for efficient near field scanning

Reconfigurable electric field probe

Capacitor structure for power delivery applications

Low profile reinforced package-on-package semiconductor device

Bandpass filter implementation on a single layer using spiral capacitors

Embedded package substrate capacitor with configurable/controllable equivalent series resistance

Capacitor structure for wideband resonance suppression in power delivery networks

BOEING CO

Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance

Variable radio frequency attenuator

Fire suppressing device

Thin film resistor having surface mounted trimming bridges for incrementally tuning resistance

High impedance surface (HIS) enhanced by discrete passives

RF filter device for aircraft nacelle access door gap

Electrical module assembly with embedded dies

Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicle

Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives