Inventor

NITTA SATYA V

US29 patents

⚠️ This page may combine multiple inventors who share the name “NITTA SATYA V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NITTA SATYA V

IBM

Very low effective dielectric constant interconnect structures and methods for fabricating the same

Very low effective dielectric constant interconnect Structures and methods for fabricating the same

Closed air gap interconnect structure

System, method and computer program product for creating a summarization from recorded audio of meetings

Bilayer metal capping layer for interconnect applications

Method of forming closed air gap interconnects and structures formed thereby

Method of forming closed air gap interconnects and structures formed thereby

Interconnect structures with engineered dielectrics with nanocolumnar porosity

Method for manufacturing interconnect structures incorporating air gap spacers

System, method and computer program product for creating a summarization from recorded audio of meetings

Process for reversing tone of patterns on integerated circuit and structural process for nanoscale fabrication

Interconnect structures incorporating air gap spacers

System, method and computer program product for creating a summarization from recorded audio of meetings

Interconnect structures with engineered dielectrics with nanocolumnar porosity

Bilayer metal capping layer for interconnect applications

Surface treatment for selective metal cap applications

Summarization method for recorded audio

Summarization method for recorded audio

Interconnect structures incorporating air-gap spacers

MERLYN MIND INC

Generating compound action links in a multi-modal networked environment

Media hub

Content transfer among remote-control units and integrated output devices

Context-sensitive customization of remote-control unit

ARNOLD JOHN C

Methods to mitigate plasma damage in organosilicate dielectrics

Methods to mitigate plasma damage in organosilicate dielectrics

NITTA SATYA V

Interconnect structures incorporating air-gap spacers

Interconnect structures incorporating air-gap spacers

CLEVENGER LAWRENCE A

Reversing tone of patterns on integrated circuit and nanoscale fabrication

COLBURN MATTHEW E

Interconnect structures with engineered dielectrics with nanocolumnar porosity