Inventor
BERGSTROM DANIEL B
US15 patents
⚠️ This page may combine multiple inventors who share the name “BERGSTROM DANIEL B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS11018222B1May 25, 2021
Metallization in integrated circuit structures
INTEL CORP16 citations82
US11094587B2Aug 17, 2021
Use of noble metals in the formation of conductive connectors
INTEL CORP0 citations62
US11063151B2Jul 13, 2021
Metal chemical vapor deposition approaches for fabricating wrap-around contacts and resulting structures
INTEL CORP0 citations62
US9090964B2Jul 28, 2015
Additives to improve the performance of a precursor source for cobalt deposition
INTEL CORP2 citations62
US10020375B2Jul 10, 2018
Tungsten gates for non-planar transistors
INTEL CORP0 citations49
US9812546B2Nov 7, 2017
Tungsten gates for non-planar transistors
INTEL CORP0 citations49
US9637810B2May 2, 2017
Tungsten gates for non-planar transistors
INTEL CORP0 citations49
US9580776B2Feb 28, 2017
Tungsten gates for non-planar transistors
INTEL CORP0 citations49
US10651082B2May 12, 2020
Diffusion barriers
INTEL CORP0 citations48
US10096513B2Oct 9, 2018
Direct plasma densification process and semiconductor devices
INTEL CORP0 citations48
US9711399B2Jul 18, 2017
Direct plasma densification process and semiconductor devices
INTEL CORP1 citations48
US10777421B2Sep 15, 2020
Technologies for selectively etching oxide and nitride materials and products formed using the same
INTEL CORP0 citations34