Inventor

LIU YUEH-LIANG

TW2 patents

Patents

2 patents

US6395646B1May 28, 2002

Machine for etching the edge of a wafer and method of etching the edge of a wafer

WINBOND ELECTRONICS CORP16 citations74

US6780780B2Aug 24, 2004

Method for removing Si-needles of wafer

WINBOND ELECTRONICS CORP0 citations42