Inventor
KINSMAN LARRY
US33 patents
⚠️ This page may combine multiple inventors who share the name “KINSMAN LARRY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
19 patentsUS6563712B2May 13, 2003
Heak sink chip package
MICRON TECHNOLOGY INC154 citations99
US6291894B1Sep 18, 2001
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC293 citations99
US6122171ASep 19, 2000
Heat sink chip package and method of making
MICRON TECHNOLOGY INC311 citations99
US5107328AApr 21, 1992
Packaging means for a semiconductor die having particular shelf structure
MICRON TECHNOLOGY INC291 citations99
US6493229B2Dec 10, 2002
Heat sink chip package
MICRON TECHNOLOGY INC76 citations96
US6426875B1Jul 30, 2002
Heat sink chip package
MICRON TECHNOLOGY INC46 citations96
US6320253B1Nov 20, 2001
Semiconductor device comprising a socket and method for forming same
MICRON TECHNOLOGY INC21 citations93
US6114770ASep 5, 2000
Low profile semiconductor package
MICRON TECHNOLOGY INC24 citations93
US6511863B2Jan 28, 2003
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC18 citations92
US7065868B2Jun 27, 2006
Methods for installing a circuit device
MICRON TECHNOLOGY INC5 citations74
US6903465B2Jun 7, 2005
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC11 citations74
US6777261B2Aug 17, 2004
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC8 citations74
US6681480B1Jan 27, 2004
Method and apparatus for installing a circuit device
MICRON TECHNOLOGY INC6 citations74
US6669738B2Dec 30, 2003
Low profile semiconductor package
MICRON TECHNOLOGY INC6 citations74
US7384805B2Jun 10, 2008
Transfer mold semiconductor packaging processes
MICRON TECHNOLOGY INC5 citations70
US7148083B2Dec 12, 2006
Transfer mold semiconductor packaging processes
MICRON TECHNOLOGY INC5 citations70
US7600314B2Oct 13, 2009
Methods for installing a plurality of circuit devices
MICRON TECHNOLOGY INC0 citations52
US6495400B1Dec 17, 2002
Method of forming low profile semiconductor package
MICRON TECHNOLOGY INC0 citations52
US7095115B2Aug 22, 2006
Circuit substrates, semiconductor packages, and ball grid arrays
MICRON TECHNOLOGY INC0 citations48
ORIN TECH LLC
6 patentsUS9878301B1Jan 30, 2018
Method and composition for the remediation of contaminants
ORIN TECH LLC17 citations91
US9561530B1Feb 7, 2017
Method for the in situ remediation of contaminants
ORIN TECH LLC31 citations91
US11499281B2Nov 15, 2022
Biochar containment boom and blanket
ORIN TECH LLC0 citations60
US10767460B2Sep 8, 2020
Method of chemically delaying peroxygen based viscosity reduction reactions
ORIN TECH LLC1 citations57
US10053617B2Aug 21, 2018
Method of chemically increasing the efficiency of peroxygen based viscosity reduction reactions
ORIN TECH LLC0 citations46
US9771782B2Sep 26, 2017
Method of chemically delaying peroxygen based viscosity reduction reactions
ORIN TECH LLC0 citations46
SEMICONDUCTOR COMPONENTS IND LLC
5 patentsUS9754983B1Sep 5, 2017
Chip scale package and related methods
SEMICONDUCTOR COMPONENTS IND LLC6 citations82
US10290672B2May 14, 2019
Image sensor semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC5 citations71
US11508776B2Nov 22, 2022
Image sensor semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US10079254B2Sep 18, 2018
Chip scale package and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations61
US10770492B2Sep 8, 2020
Chip scale package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations50