Inventor

LIU YU-CHIH

TW39 patents

⚠️ This page may combine multiple inventors who share the name “LIU YU-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU YU-CHIH

TAIWAN SEMICONDUCTOR MFG CO LTD

Lid design for heat dissipation enhancement of die package

Semiconductor packaging structure and process

Lid structure for a semiconductor device package and method for forming the same

Semiconductor device and manufacturing method thereof

System and method for bonding package lid

Package-on-package with redistribution structure

Method for forming a lid structure for a semiconductor device package

Semiconductor packaging structure and process

Method of manufacturing a chip package

Packaging methods for semiconductor devices with encapsulant ring

Flip chip packaging

Package-on-package structure having polymer-based material for warpage control

Adhesive pattern for advance package reliability improvement

Packages with die stack including exposed molding underfill

Lid attach process and dispenser head

Package-on-package structure having polymer-based material for warpage control

System and method for bonding package lid

Semiconductor packaging structure and process

Methods of forming package-on-package structures

Package-on-package structure having polymer-based material for warpage control

System and method for bonding package lid

Package structure and methods of forming the same

Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device

Lid attach processes for semiconductor packages

Lid attach process and apparatus for fabrication of semiconductor packages

LIU YU-CHIH

Apparatus and methods for semiconductor packages with improved warpage

Flip-chip BGA assembly process

SUNG MING-CHUNG

Method and apparatus for die assembly

Methods and apparatus for alignment in flip chip bonding

TAIWAN SEMICONDUCTOR MFG

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

ACCTON TECHNOLOGY CORP

Linking apparatus for stackable network devices

CHEN MENG-TSE

Package-on-package structure having polymer-based material for warpage control

LIN WEN YI

Ring structure for chip packaging

CHEN CHIN-LIANG

Lid attach process and apparatus for fabrication of semiconductor packages

CHEN YONG-SHENG

Image synthesis system for a vehicle and the manufacturing method thereof

(unassigned)

Hydraulic damping device

LU JING RUEI

Rotating curing

ULEAD SYSTEMS INC

Method of opening/closing a disk tray in a disk drive