Inventor
LIN SHIH-YEN
TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN SHIH-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
35 patentsUS9735043B2Aug 15, 2017
Semiconductor packaging structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations92
US9786520B2Oct 10, 2017
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9673119B2Jun 6, 2017
System and method for bonding package lid
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9577049B1Feb 21, 2017
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations82
US9899537B2Feb 20, 2018
Semiconductor device with transition metal dichalocogenide hetero-structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations80
US10157772B2Dec 18, 2018
Semiconductor packaging structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9893043B2Feb 13, 2018
Method of manufacturing a chip package
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9859115B2Jan 2, 2018
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9805997B2Oct 31, 2017
Packaging methods for semiconductor devices with encapsulant ring
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9287233B2Mar 15, 2016
Adhesive pattern for advance package reliability improvement
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US10985019B2Apr 20, 2021
Method of forming a semiconductor device using layered etching and repairing of damaged portions
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10636652B2Apr 28, 2020
Method of forming a semiconductor device using layered etching and repairing of damaged portions
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269902B2Apr 23, 2019
Semiconductor device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269564B2Apr 23, 2019
Method of forming a semiconductor device using layered etching and repairing of damaged portions
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10872973B2Dec 22, 2020
Semiconductor structures with two-dimensional materials
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US11211460B2Dec 28, 2021
2D crystal hetero-structures and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11171212B2Nov 9, 2021
Semiconductor device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9525072B2Dec 20, 2016
Semiconductor device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11152209B2Oct 19, 2021
Forming semiconductor structures with two-dimensional materials
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12513946B2Dec 30, 2025
Method for forming a semiconductor device having a 2-D material channel over a substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12363981B2Jul 15, 2025
Semiconductor device and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12266602B2Apr 1, 2025
Integrated circuit structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11121214B2Sep 14, 2021
Source/drain contact with 2-D material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US10879140B2Dec 29, 2020
System and method for bonding package lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867835B2Dec 15, 2020
Semiconductor packaging structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269668B2Apr 23, 2019
System and method for bonding package lid
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10157737B2Dec 18, 2018
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9415501B2Aug 16, 2016
Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10784351B2Sep 22, 2020
2D crystal hetero-structures and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9853105B2Dec 26, 2017
Semiconductor device and method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10541132B2Jan 21, 2020
Forming semiconductor structures with two-dimensional materials
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10147603B2Dec 4, 2018
Method of manufacturing a FET using a two dimensional transition metal dichalcogenide including a low power oxygen plasma treatment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10505052B2Dec 10, 2019
Semiconductor device with transition metal dichalocogenide hetero-structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10164122B2Dec 25, 2018
Semiconductor device with transition metal dichalocogenide hetero-structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US12080557B2Sep 3, 2024
Method for forming 2-D material semiconductor device with improved source/drain electrodes and gate dielectric
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations44