P

Inventor

LIN SHIH-YEN

TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN SHIH-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

35 patents
US9735043B2Aug 15, 2017

Semiconductor packaging structure and process

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations92
US9786520B2Oct 10, 2017

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9673119B2Jun 6, 2017

System and method for bonding package lid

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9577049B1Feb 21, 2017

Semiconductor device structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations82
US9899537B2Feb 20, 2018

Semiconductor device with transition metal dichalocogenide hetero-structure

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations80
US10157772B2Dec 18, 2018

Semiconductor packaging structure and process

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9893043B2Feb 13, 2018

Method of manufacturing a chip package

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9859115B2Jan 2, 2018

Semiconductor devices comprising 2D-materials and methods of manufacture thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9805997B2Oct 31, 2017

Packaging methods for semiconductor devices with encapsulant ring

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9287233B2Mar 15, 2016

Adhesive pattern for advance package reliability improvement

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US10985019B2Apr 20, 2021

Method of forming a semiconductor device using layered etching and repairing of damaged portions

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10636652B2Apr 28, 2020

Method of forming a semiconductor device using layered etching and repairing of damaged portions

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269902B2Apr 23, 2019

Semiconductor device and method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269564B2Apr 23, 2019

Method of forming a semiconductor device using layered etching and repairing of damaged portions

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10872973B2Dec 22, 2020

Semiconductor structures with two-dimensional materials

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US11211460B2Dec 28, 2021

2D crystal hetero-structures and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11171212B2Nov 9, 2021

Semiconductor device and method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9525072B2Dec 20, 2016

Semiconductor device and method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11152209B2Oct 19, 2021

Forming semiconductor structures with two-dimensional materials

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12513946B2Dec 30, 2025

Method for forming a semiconductor device having a 2-D material channel over a substrate

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12363981B2Jul 15, 2025

Semiconductor device and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12266602B2Apr 1, 2025

Integrated circuit structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11121214B2Sep 14, 2021

Source/drain contact with 2-D material

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US10879140B2Dec 29, 2020

System and method for bonding package lid

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867835B2Dec 15, 2020

Semiconductor packaging structure and process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269668B2Apr 23, 2019

System and method for bonding package lid

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10157737B2Dec 18, 2018

Semiconductor devices comprising 2D-materials and methods of manufacture thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9415501B2Aug 16, 2016

Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10784351B2Sep 22, 2020

2D crystal hetero-structures and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9853105B2Dec 26, 2017

Semiconductor device and method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10541132B2Jan 21, 2020

Forming semiconductor structures with two-dimensional materials

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10147603B2Dec 4, 2018

Method of manufacturing a FET using a two dimensional transition metal dichalcogenide including a low power oxygen plasma treatment

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10505052B2Dec 10, 2019

Semiconductor device with transition metal dichalocogenide hetero-structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10164122B2Dec 25, 2018

Semiconductor device with transition metal dichalocogenide hetero-structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US12080557B2Sep 3, 2024

Method for forming 2-D material semiconductor device with improved source/drain electrodes and gate dielectric

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations44

TAIWAN SEMICONDUCTOR MFG

2 patents

IND TECH RES INST

1 patent

CHUNG SHAN INST OF SCIENCE

1 patent

ACADEMIA SINICA

1 patent

UNIV NAT TAIWAN

1 patent

NATIONAL YANG MING CHIAO TUNG UNIV

1 patent