P

Inventor

LIN WEI-TING

TW67 patents
⚠️ This page may combine multiple inventors who share the name “LIN WEI-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US9735043B2Aug 15, 2017

Semiconductor packaging structure and process

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations92
US10043761B2Aug 7, 2018

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9786520B2Oct 10, 2017

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9673119B2Jun 6, 2017

System and method for bonding package lid

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US11552054B2Jan 10, 2023

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11417643B2Aug 16, 2022

Package-on-package with redistribution structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10510681B2Dec 17, 2019

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10157772B2Dec 18, 2018

Semiconductor packaging structure and process

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9893043B2Feb 13, 2018

Method of manufacturing a chip package

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9805997B2Oct 31, 2017

Packaging methods for semiconductor devices with encapsulant ring

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9287233B2Mar 15, 2016

Adhesive pattern for advance package reliability improvement

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US9793242B2Oct 17, 2017

Packages with die stack including exposed molding underfill

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US9501593B2Nov 22, 2016

Semiconductor device design method, system and computer program product

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12046480B2Jul 23, 2024

Manufacturing method of a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11211339B2Dec 28, 2021

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10727082B2Jul 28, 2020

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11972956B2Apr 30, 2024

Lid attach process and dispenser head

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10879140B2Dec 29, 2020

System and method for bonding package lid

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867835B2Dec 15, 2020

Semiconductor packaging structure and process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10515941B2Dec 24, 2019

Methods of forming package-on-package structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269668B2Apr 23, 2019

System and method for bonding package lid

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9859265B2Jan 2, 2018

Package structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9661794B1May 23, 2017

Method of manufacturing package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9415501B2Aug 16, 2016

Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10685853B2Jun 16, 2020

Lid attach processes for semiconductor packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9502373B2Nov 22, 2016

Lid attach process and apparatus for fabrication of semiconductor packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

J-METRICS TECH CO LTD

3 patents

WUU DONG-SING

2 patents

AU OPTRONICS CORP

2 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

LSI LOGIC CORP

1 patent

LIN WEN YI

1 patent

HUANG MU-JEN

1 patent

CHEN CHIN-LIANG

1 patent

LIU YU-CHIH

1 patent

LIU PO-TSUN

1 patent

SUNG MING-CHUNG

1 patent

CHEN CHIA-HSIANG

1 patent

J METRICS TECH CO LTD

1 patent

ASUSTEK COMP INC

1 patent

MOSEL VITELIC INC

1 patent

LIN WEI TING

1 patent

ROLENCE ENTPR INC

1 patent

LITE ON TECHNOLOGY CORP

1 patent

LU JING RUEI

1 patent

Showing the top 50 of 67 patents by PatentIndex Score.