Inventor
SHIN HEONJONG
KR32 patents
⚠️ This page may combine multiple inventors who share the name “SHIN HEONJONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
27 patentsUS5300816AApr 5, 1994
Semiconductor wafer with improved step coverage along scribe lines
SAMSUNG ELECTRONICS CO LTD24 citations84
US10373953B2Aug 6, 2019
Semiconductor device including a semiconductor extension layer between active regions
SAMSUNG ELECTRONICS CO LTD5 citations83
US10923475B2Feb 16, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD6 citations82
US12382681B2Aug 5, 2025
Multi-bridge channel field effect transistor with reduced gate-channel leakage current
SAMSUNG ELECTRONICS CO LTD2 citations73
US10825810B2Nov 3, 2020
Semicondcutor device including a semiconductor extension layer between active regions
SAMSUNG ELECTRONICS CO LTD2 citations72
US11264386B2Mar 1, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US11177362B2Nov 16, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US10964791B2Mar 30, 2021
Semiconductor device having silicides and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US10497608B2Dec 3, 2019
Semiconductor devices having isolation insulating layers and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US10204821B2Feb 12, 2019
Semiconductor devices having isolation insulating layers and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US11393909B2Jul 19, 2022
Semiconductor devices inlcluding a fin field effect transistor
SAMSUNG ELECTRONICS CO LTD2 citations70
US7923805B2Apr 12, 2011
Semiconductor device including high voltage and low voltage MOS devices
SAMSUNG ELECTRONICS CO LTD6 citations69
US9576613B2Feb 21, 2017
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations64
US11728342B2Aug 15, 2023
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11335679B2May 17, 2022
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11735640B2Aug 22, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11538913B2Dec 27, 2022
Semiconductor device having silicides and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11978775B2May 7, 2024
Method of fabricating semiconductor devices including a fin field effect transistor
SAMSUNG ELECTRONICS CO LTD0 citations60
US11705454B2Jul 18, 2023
Active regions via contacts having various shaped segments off-set from gate via contact
SAMSUNG ELECTRONICS CO LTD0 citations60
US10453838B2Oct 22, 2019
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations60
US12014957B2Jun 18, 2024
Semiconductor device having a source/drain contact plug with an upwardly protruding portion
SAMSUNG ELECTRONICS CO LTD0 citations59
US11309218B2Apr 19, 2022
Method of manufacturing a semiconductor device having a source/drain contact plug with a recessed portion using a mask pattern layer
SAMSUNG ELECTRONICS CO LTD0 citations59
US12356659B2Jul 8, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12094940B2Sep 17, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12525535B2Jan 13, 2026
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations50
US10636785B2Apr 28, 2020
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations50
US12563775B2Feb 24, 2026
Transistor devices having buried interconnection line below source/drain regions and one or more protective layers covering lower surfaces of gate structures
SAMSUNG ELECTRONICS CO LTD0 citations47