Inventor
KALNITSKY ALEXANDER
US271 patents
⚠️ This page may combine multiple inventors who share the name “KALNITSKY ALEXANDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
27 patentsUS6208557B1Mar 27, 2001
EPROM and flash memory cells with source-side injection and a gate dielectric that traps hot electrons during programming
NAT SEMICONDUCTOR CORP220 citations99
US6137723AOct 24, 2000
Memory device having erasable Frohmann-Bentchkowsky EPROM cells that use a well-to-floating gate coupled voltage during erasure
NAT SEMICONDUCTOR CORP118 citations98
US6137724AOct 24, 2000
Memory device that utilizes single-poly EPROM cells with CMOS compatible programming voltages
NAT SEMICONDUCTOR CORP63 citations96
US6137722AOct 24, 2000
Memory array having Frohmann-Bentchkowsky EPROM cells with a reduced number of access transistors
NAT SEMICONDUCTOR CORP59 citations96
US6081451AJun 27, 2000
Memory device that utilizes single-poly EPROM cells with CMOS compatible programming voltages
NAT SEMICONDUCTOR CORP71 citations96
US6055185AApr 25, 2000
Single-poly EPROM cell with CMOS compatible programming voltages
NAT SEMICONDUCTOR CORP68 citations96
US5982669ANov 9, 1999
EPROM and flash memory cells with source-side injection
NAT SEMICONDUCTOR CORP57 citations95
US6525397B1Feb 25, 2003
Extended drain MOSFET for programming an integrated fuse element to high resistance in low voltage process technology
NAT SEMICONDUCTOR CORP38 citations93
US6420217B1Jul 16, 2002
Method of an apparatus for programming an integrated fuse element to high resistance in low voltage technology
NAT SEMICONDUCTOR CORP33 citations93
US6384398B1May 7, 2002
CMOS compatible pixel cell that utilizes a gated diode to reset the cell
NAT SEMICONDUCTOR CORP17 citations93
US6380571B1Apr 30, 2002
CMOS compatible pixel cell that utilizes a gated diode to reset the cell
NAT SEMICONDUCTOR CORP16 citations93
US6368917B1Apr 9, 2002
Methods of fabricating floating gate semiconductor device with reduced erase voltage
NAT SEMICONDUCTOR CORP17 citations93
US6362023B1Mar 26, 2002
Dielectric-based anti-fuse cell with polysilicon contact plug and method for its manufacture
NAT SEMICONDUCTOR CORP20 citations93
US6271560B1Aug 7, 2001
Single-poly EPROM cell with CMOS compatible programming voltages
NAT SEMICONDUCTOR CORP27 citations93
US6249010B1Jun 19, 2001
Dielectric-based anti-fuse cell with polysilicon contact plug and method for its manufacture
NAT SEMICONDUCTOR CORP37 citations93
US6236082B1May 22, 2001
Floating gate semiconductor device with reduced erase voltage
NAT SEMICONDUCTOR CORP26 citations93
US6177315B1Jan 23, 2001
Method of fabricating a high density EEPROM array
NAT SEMICONDUCTOR CORP33 citations93
US6166421ADec 26, 2000
Polysilicon fuse that provides an open current path when programmed without exposing the fuse to the environment
NAT SEMICONDUCTOR CORP26 citations93
US6157574ADec 5, 2000
Erasable frohmann-bentchkowsky memory transistor that stores multiple bits of data
NAT SEMICONDUCTOR CORP43 citations93
US6137721AOct 24, 2000
Memory device having erasable frohmann-bentchkowsky EPROM cells that use a plate-to-floating gate coupled voltage during erasure
NAT SEMICONDUCTOR CORP50 citations93
US6130840AOct 10, 2000
Memory cell having an erasable Frohmann-Bentchkowsky memory transistor
NAT SEMICONDUCTOR CORP34 citations93
US6122204ASep 19, 2000
Sense amplifier having a bias circuit with a reduced size
NAT SEMICONDUCTOR CORP26 citations93
US6087211AJul 11, 2000
Method for forming a semiconductor device having non-volatile memory cells, High-voltage transistors, and low-voltage, deep sub-micron transistors
NAT SEMICONDUCTOR CORP45 citations93
US6031275AFeb 29, 2000
Antifuse with a silicide layer overlying a diffusion region
NAT SEMICONDUCTOR CORP25 citations93
US6190968B1Feb 20, 2001
Method for forming EPROM and flash memory cells with source-side injection
NAT SEMICONDUCTOR CORP35 citations92
US6184557B1Feb 6, 2001
I/O circuit that utilizes a pair of well structures as resistors to delay an ESD event and as diodes for ESD protection
NAT SEMICONDUCTOR CORP40 citations92
US6169310B1Jan 2, 2001
Electrostatic discharge protection device
NAT SEMICONDUCTOR CORP34 citations92
SGS THOMSON MICROELECTRONICS
6 patentsUS5608250AMar 4, 1997
Volatile memory cell with interface charge traps
SGS THOMSON MICROELECTRONICS190 citations99
US5633178AMay 27, 1997
Method of making volatile memory cell with interface charge traps
SGS THOMSON MICROELECTRONICS108 citations98
US5470793ANov 28, 1995
Method of via formation for the multilevel interconnect integrated circuits
SGS THOMSON MICROELECTRONICS46 citations96
US5786613AJul 28, 1998
Integrated overvoltage protection device having electrodes separated by a gas-filled cavity
SGS THOMSON MICROELECTRONICS24 citations93
US5589418ADec 31, 1996
Method of forming a polysilicon buried contact
SGS THOMSON MICROELECTRONICS32 citations93
US5589708ADec 31, 1996
Radiation hard integrated circuits with implanted silicon in gate oxide layer, field oxide region, and interlevel dielectric layer
SGS THOMSON MICROELECTRONICS22 citations93
ST MICROELECTRONICS INC
5 patentsUS6483931B2Nov 19, 2002
Electrostatic discharge protection of a capacitve type fingerprint sensing array
ST MICROELECTRONICS INC101 citations99
US6011859AJan 4, 2000
Solid state fingerprint sensor packaging apparatus and method
ST MICROELECTRONICS INC138 citations98
US5982608ANov 9, 1999
Semiconductor variable capacitor
ST MICROELECTRONICS INC51 citations96
US6188056B1Feb 13, 2001
Solid state optical imaging pixel with resistive load
ST MICROELECTRONICS INC31 citations92
US6110791AAug 29, 2000
Method of making a semiconductor variable capacitor
ST MICROELECTRONICS INC28 citations92
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS10050033B1Aug 14, 2018
High voltage integration for HKMG technology
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9923013B1Mar 20, 2018
Sensor device, image sensor array and manufacturing method of sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations94
US10157778B2Dec 18, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations93
MAXIM INTEGRATED PRODUCTS
3 patentsUS6303413B1Oct 16, 2001
Method of forming a shallow and deep trench isolation (SDTI) suitable for silicon on insulator (SOI) substrates
MAXIM INTEGRATED PRODUCTS61 citations94
US6593640B1Jul 15, 2003
Bipolar transistor and methods of forming bipolar transistors
MAXIM INTEGRATED PRODUCTS26 citations92
US6686250B1Feb 3, 2004
Method of forming self-aligned bipolar transistor
MAXIM INTEGRATED PRODUCTS38 citations91
UPEK INC
2 patentsKALNITSKY ALEXANDER
2 patentsINTERSIL INC
2 patentsShowing the top 50 of 271 patents by PatentIndex Score.