Inventor
LIANG KAI-CHIH
TW26 patents
⚠️ This page may combine multiple inventors who share the name “LIANG KAI-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS9910009B2Mar 6, 2018
CMOS compatible BioFET
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US9791406B2Oct 17, 2017
CMOS compatible BioFET
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9617147B2Apr 11, 2017
Dual layer microelectromechanical systems device and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12529675B2Jan 20, 2026
CMOS compatible BioFET
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11486854B2Nov 1, 2022
CMOS compatible BioFET
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9254997B2Feb 9, 2016
CMOS-MEMS integrated flow for making a pressure sensitive transducer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US11180365B2Nov 23, 2021
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12170214B2Dec 17, 2024
Semiconductor device manufacturing system and method for manufacturing semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10520467B2Dec 31, 2019
CMOS compatible BioFET
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10457550B2Oct 29, 2019
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10099919B2Oct 16, 2018
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9499396B2Nov 22, 2016
MEMS devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9449867B2Sep 20, 2016
VHF etch barrier for semiconductor integrated microsystem
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
8 patentsUS9133017B2Sep 15, 2015
MEMS structure with adaptable inter-substrate bond
TAIWAN SEMICONDUCTOR MFG49 citations98
US8748205B1Jun 10, 2014
MEMS structure with adaptable inter-substrate bond
TAIWAN SEMICONDUCTOR MFG5 citations84
US8012785B2Sep 6, 2011
Method of fabricating an integrated CMOS-MEMS device
TAIWAN SEMICONDUCTOR MFG16 citations82
US9006015B2Apr 14, 2015
Dual layer microelectromechanical systems device and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG2 citations63
US8633554B2Jan 21, 2014
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG3 citations62
US8368152B2Feb 5, 2013
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG4 citations62
US7732299B2Jun 8, 2010
Process for wafer bonding
TAIWAN SEMICONDUCTOR MFG6 citations58
US9359194B2Jun 7, 2016
MEMS devices, packaged MEMS devices, and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG0 citations52