Inventor

CHENG CHUN-WEN

TW250 patents

⚠️ This page may combine multiple inventors who share the name “CHENG CHUN-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG CHUN-WEN

TAIWAN SEMICONDUCTOR MFG CO LTD

CMOS-MEMS device structure, bonding mesa structure and associated method

MEMS and CMOS integration with low-temperature bonding

Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer

Amplified dual-gate bio field effect transistor

MEMS structure and manufacturing method thereof

Micro electromechanical system sensor and method of forming the same

Multi-pressure MEMS package

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for fabricating the same

MEMS integrated pressure sensor devices and methods of forming same

MEMS integrated pressure sensor and microphone devices and methods of forming same

MEMS devices including MEMS dies and connectors thereto

CMOS compatible BioFET

Semiconductor sensing structure and manufacturing method thereof

CMOS compatible BioFET

Backside CMOS compatible BioFET with no plasma induced damage

Integrated semiconductor device and wafer level method of fabricating the same

MEMS device

MEMS device with a capping substrate

Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate

MEMS pressure sensor and microphone devices having through-vias and methods of forming same

Gas sensor, integrated circuit device using the same, and manufacturing method thereof

Method for the integration of a microelectromechanical systems (MEMS) microphone device with a complementary metal-oxide-semiconductor (CMOS) device

Top-down fabrication method for forming a nanowire transistor device

Backside sensing BioFET with enhanced performance

TAIWAN SEMICONDUCTOR MFG

Backside CMOS compatible bioFET with no plasma induced damage

MEMS integrated pressure sensor and microphone devices and methods of forming same

MEMS devices and methods for forming same

Backside CMOS compatible BioFET with no plasma induced damage

MEMS integrated pressure sensor devices and methods of forming same

Backside sensing bioFET with enhanced performance

MEMS device and method of forming the same

Surface modification, functionalization and integration of microfluidics and biosensor to form a biochip

MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same

MEMS device and method of forming the same

MEMS devices and methods for forming same

MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same

MEMS integrated pressure sensor devices and methods of forming same

Semiconductor arrangement with stress release configuration

Semiconductor device

Integrated semiconductor device and wafer level method of fabricating the same

Method for forming biochips and biochips with non-organic landings for improved thermal budget

LIU PING-YIN

MEMS structures and methods for forming the same

Self-removal anti-stiction coating for bonding process

KALNITSKY ALEXANDER

CMOS compatible BioFET

UNITED MICROELECTRONICS CORP

Method for fabricating deep trench capacitor

LIANG KAI-CHIH

MEMS devices, packaged MEMS devices, and methods of manufacture thereof

CHU CHIA-HUA

MEMS devices and methods for forming the same

LIN CHUNG-HSIEN

MEMS device with release aperture

LIU MARTIN

Wafer level packaging bond