P

Inventor

TANG TZU-CHUN

TW34 patents
⚠️ This page may combine multiple inventors who share the name “TANG TZU-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

32 patents
US10157834B1Dec 18, 2018

Electronic apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD24 citations94
US11587916B2Feb 21, 2023

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations86
US10867938B2Dec 15, 2020

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations86
US10777518B1Sep 15, 2020

Package structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations86
US10868353B2Dec 15, 2020

Electronic device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10672728B2Jun 2, 2020

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10050013B2Aug 14, 2018

Packaged semiconductor devices and packaging methods

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10043761B2Aug 7, 2018

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10366966B1Jul 30, 2019

Method of manufacturing integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US11348886B2May 31, 2022

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11335767B2May 17, 2022

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11211358B2Dec 28, 2021

Packaged semiconductor devices and packaging methods

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11171088B2Nov 9, 2021

Electronic apparatus including antennas and directors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510714B2Dec 17, 2019

Packaged semiconductor devices and packaging methods

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10510681B2Dec 17, 2019

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10304614B2May 28, 2019

Stacked coil for wireless charging structure on InFO package

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10128203B2Nov 13, 2018

Fan-out package structure, antenna system and associated method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9601439B1Mar 21, 2017

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11450628B2Sep 20, 2022

Package structure including a solenoid inductor laterally aside a die and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10756052B2Aug 25, 2020

Method of manufacturing integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12136593B2Nov 5, 2024

Electronic apparatus including antennas and directors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12094860B2Sep 17, 2024

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12033963B2Jul 9, 2024

Package structure comprising thermally conductive layer around the IC die

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11854928B2Dec 26, 2023

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11211339B2Dec 28, 2021

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12334457B2Jun 17, 2025

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11929333B2Mar 12, 2024

Integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11282810B2Mar 22, 2022

Integrated fan-out package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12512405B2Dec 30, 2025

Semiconductor package and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10825602B2Nov 3, 2020

Stacked coil for wireless charging structure on InFO package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510478B2Dec 17, 2019

Stacked coil for wireless charging structure on InFO package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269481B2Apr 23, 2019

Stacked coil for wireless charging structure on InFO package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

LIN KEN-HUANG

1 patent

TAI SAW TECHNOLOGY CO LTD

1 patent