Inventor

TSAI CHUNG-HAO

TW118 patents

⚠️ This page may combine multiple inventors who share the name “TSAI CHUNG-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI CHUNG-HAO

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure, semiconductor chip and method of fabricating the same

Antennas and waveguides in InFO structures

Electronic apparatus

Package structure and manufacturing method thereof

Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same

Memory packages and methods of forming same

Package structure and method of forming the same

Package structure

Methods of forming semiconductor packages having a die with an encapsulant

Photonic semiconductor device and method

Passive device module, semiconductor package including the same, and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor structure, package structure, and manufacturing method thereof

Antenna device and method for manufacturing antenna device

Package structure with inductor and method of forming thereof

Package with thinned substrate

Antennas and waveguides in InFO structures

Package structure

Package structures

Method of manufacturing integrated fan-out package

3D antenna for integrated circuits

Architecture for computing system package

Package assembly and manufacturing method thereof

Architecture for computing system package

Semiconductor device with shielding structure for cross-talk reduction

Semiconductor packages having a die, an encapsulant, and a redistribution structure

Semiconductor package and manufacturing method thereof

Memory packages and methods of forming same

Method of manufacturing package structure

Package structure and manufacturing method thereof

Antenna device and method for manufacturing antenna device

Semiconductor structure, package structure, and manufacturing method thereof

Semiconductor package and method of forming the same

Semiconductor device, integrated fan-out package and method of forming the same

Die stacks and methods forming same

Semiconductor package and manufacturing method thereof

Electronic apparatus including antennas and directors

Semiconductor package and manufacturing method thereof

Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas

Photonic semiconductor device and method

Semiconductor device and method of manufacture

Die stacks and methods forming same

Package structure and method of manufacturing the same

Package structure having connecting module

Integrated fan-out package

Semiconductor device with shielding structure for cross-talk reduction

Embedding low-k materials in antennas

WU TZONG-LIN

Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal

Common mode noise suppression circuit

TAIWAN SEMICONDUCTOR MFG

Embedding low-k materials in antennas