P

Inventor

CHEN TIEN-SZU

TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHEN TIEN-SZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

23 patents
US8884443B2Nov 11, 2014

Substrate for semiconductor package and process for manufacturing

ADVANCED SEMICONDUCTOR ENG6 citations83
US10446411B2Oct 15, 2019

Semiconductor device package with a conductive post

ADVANCED SEMICONDUCTOR ENG5 citations82
US10157887B2Dec 18, 2018

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG9 citations82
US10181438B2Jan 15, 2019

Semiconductor substrate mitigating bridging

ADVANCED SEMICONDUCTOR ENG4 citations73
US10515884B2Dec 24, 2019

Substrate having a conductive structure within photo-sensitive resin

ADVANCED SEMICONDUCTOR ENG2 citations72
US9984989B2May 29, 2018

Semiconductor substrate and semiconductor package structure

ADVANCED SEMICONDUCTOR ENG2 citations72
US10629519B2Apr 21, 2020

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG6 citations71
US10573624B2Feb 25, 2020

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG4 citations71
US10134683B2Nov 20, 2018

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG6 citations71
US10049893B2Aug 14, 2018

Semiconductor device with a conductive post

ADVANCED SEMICONDUCTOR ENG4 citations71
US11398421B2Jul 26, 2022

Semiconductor substrate and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US9437532B2Sep 6, 2016

Substrate for semiconductor package and process for manufacturing

ADVANCED SEMICONDUCTOR ENG1 citations62
US9224707B2Dec 29, 2015

Substrate for semiconductor package and process for manufacturing

ADVANCED SEMICONDUCTOR ENG1 citations62
US12444689B2Oct 14, 2025

Semiconductor package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations58
US11894308B2Feb 6, 2024

Semiconductor package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations58
US10332851B2Jun 25, 2019

Semiconductor device package and a method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations52
US10103110B2Oct 16, 2018

Semiconductor package structure and fabrication method thereof

ADVANCED SEMICONDUCTOR ENG0 citations51
US10049976B2Aug 14, 2018

Semiconductor substrate and manufacturing method thereof

ADVANCED SEMICONDUCTOR ENG0 citations51
US9911702B2Mar 6, 2018

Semiconductor package structure and fabrication method thereof

ADVANCED SEMICONDUCTOR ENG1 citations51
US8866311B2Oct 21, 2014

Semiconductor package substrates having pillars and related methods

ADVANCED SEMICONDUCTOR ENG0 citations48
US10854550B2Dec 1, 2020

Semiconductor package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations47
US10879159B2Dec 29, 2020

Substrate, semiconductor package thereof and process of making same

ADVANCED SEMICONDUCTOR ENG0 citations41
US10002843B2Jun 19, 2018

Semiconductor substrate structure, semiconductor package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations41

GINTECH ENERGY CORP

2 patents

WANG CHEN-CHAN

2 patents

CHIOU YAN-KAI

1 patent