Inventor

YEN YOU-LUNG

TW40 patents

⚠️ This page may combine multiple inventors who share the name “YEN YOU-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEN YOU-LUNG

ADVANCED SEMICONDUCTOR ENG

Semiconductor package and semiconductor process

Semiconductor device package and method for manufacturing the same

Package substrate including an optically-cured dielecetric layer and method for manufacturing the package substrate

Semiconductor device package and method of manufacturing the same

Semiconductor substrate mitigating bridging

Double side via last method for double embedded patterned substrate

Double side via last method for double embedded patterned substrate

Electronic package and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Electronic package including a protection layer

Semiconductor package structure and method for manufacturing the same

Electronic package and method of manufacturing the same

Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure

Semiconductor device package, antenna device, and method for manufacturing the same

Substrate structure, package structure and method for manufacturing electronic package structure

Semiconductor package structure and method for manufacturing the same

Semiconductor device package

Leadframe including conductive pillar over land of conductive layer

Semiconductor package

Substrate structure, semiconductor package structure and method for manufacturing a substrate structure

Semiconductor substrate and method for manufacturing the same

Semiconductor device including metal holder and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Electronic package

Electronic package with wettable flank and shielding layer and manufacturing method thereof

Electronic package and method of forming the same

Electronic carrier and method of manufacturing the same

Semiconductor device package

Package structure and method for manufacturing the same

Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure

Semiconductor device packages and method of manufacturing the same

Semiconductor package structure and semiconductor substrate

Semiconductor package structure having substrate with embedded electronic component and conductive pillars

Package substrate and method for manufacturing the same

Semiconductor package including dielectric layers defining via holes extending to component pads

Semiconductor substrate, semiconductor package structure and method of making the same

Semiconductor substrate, semiconductor package structure and method of making the same

Semiconductor package and method of manufacturing the same

APPELT BERND KARL

Method of fabricating multi-layered substrate