P

Inventor

LEE DONG HWAN

KR137 patents
⚠️ This page may combine multiple inventors who share the name “LEE DONG HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

26 patents
US9945042B2Apr 17, 2018

Chip electronic component and manufacturing method thereof

SAMSUNG ELECTRO MECH18 citations94
US7843702B2Nov 30, 2010

Printed circuit board having embedded RF module power stage circuit

SAMSUNG ELECTRO MECH14 citations91
US10109409B2Oct 23, 2018

Chip electronic component and board for mounting thereof

SAMSUNG ELECTRO MECH8 citations84
US10079089B1Sep 18, 2018

Coil electronic component and board having the same

SAMSUNG ELECTRO MECH8 citations84
US9576711B2Feb 21, 2017

Coil component and board having the same

SAMSUNG ELECTRO MECH10 citations84
US9490062B2Nov 8, 2016

Chip electronic component

SAMSUNG ELECTRO MECH13 citations84
US9263180B2Feb 16, 2016

Coil component and board having the same

SAMSUNG ELECTRO MECH7 citations84
US9905349B2Feb 27, 2018

Chip electronic component

SAMSUNG ELECTRO MECH11 citations83
US9264010B2Feb 16, 2016

Via structure having open stub and printed circuit board having the same

SAMSUNG ELECTRO MECH9 citations83
US7557445B2Jul 7, 2009

Multilayer substrate and the manufacturing method thereof

SAMSUNG ELECTRO MECH8 citations81
US7230815B2Jun 12, 2007

Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor

SAMSUNG ELECTRO MECH20 citations80
US11756724B2Sep 12, 2023

Coil electronic component

SAMSUNG ELECTRO MECH2 citations73
US11443894B2Sep 13, 2022

Coil component

SAMSUNG ELECTRO MECH2 citations73
US11424065B2Aug 23, 2022

Coil electronic component

SAMSUNG ELECTRO MECH2 citations73
US11170927B2Nov 9, 2021

Coil component

SAMSUNG ELECTRO MECH2 citations73
US11075030B2Jul 27, 2021

Inductor array

SAMSUNG ELECTRO MECH2 citations73
US10629365B2Apr 21, 2020

Inductor array component and board for mounting the same

SAMSUNG ELECTRO MECH2 citations73
US10607765B2Mar 31, 2020

Coil component and board having the same

SAMSUNG ELECTRO MECH4 citations73
US10559413B2Feb 11, 2020

Coil electronic component

SAMSUNG ELECTRO MECH2 citations73
US9655247B1May 16, 2017

Coil component and board having the same

SAMSUNG ELECTRO MECH6 citations73
US9536660B2Jan 3, 2017

Chip electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH6 citations73
US7262675B2Aug 28, 2007

Laminated filter with improved stop band attenuation

SAMSUNG ELECTRO MECH7 citations73
US10340073B2Jul 2, 2019

Coil component and method of manufacturing the same

SAMSUNG ELECTRO MECH2 citations71
US12217896B2Feb 4, 2025

Coil component

SAMSUNG ELECTRO MECH0 citations63
US12112879B2Oct 8, 2024

Coil component

SAMSUNG ELECTRO MECH0 citations63
US12073971B2Aug 27, 2024

Coil component

SAMSUNG ELECTRO MECH0 citations63

SK HYNIX INC

6 patents

SAMSUNG DISPLAY CO LTD

4 patents

LEE DONG HWAN

3 patents

SAMSUNG ELECTRONICS CO LTD

3 patents

LG ELECTRONICS INC

2 patents

LEE DONG-HWAN

1 patent

BOE HYDIS TECHNOLOGY CO LTD

1 patent

SAMSUNG SDI CO LTD

1 patent

LUNA CO LTD

1 patent

SL CORP

1 patent

HONG SEUNG KYUN

1 patent

Showing the top 50 of 137 patents by PatentIndex Score.