Inventor
LEE DONG HWAN
KR137 patents
⚠️ This page may combine multiple inventors who share the name “LEE DONG HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
26 patentsUS9945042B2Apr 17, 2018
Chip electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH18 citations94
US7843702B2Nov 30, 2010
Printed circuit board having embedded RF module power stage circuit
SAMSUNG ELECTRO MECH14 citations91
US10109409B2Oct 23, 2018
Chip electronic component and board for mounting thereof
SAMSUNG ELECTRO MECH8 citations84
US10079089B1Sep 18, 2018
Coil electronic component and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9576711B2Feb 21, 2017
Coil component and board having the same
SAMSUNG ELECTRO MECH10 citations84
US9490062B2Nov 8, 2016
Chip electronic component
SAMSUNG ELECTRO MECH13 citations84
US9263180B2Feb 16, 2016
Coil component and board having the same
SAMSUNG ELECTRO MECH7 citations84
US9905349B2Feb 27, 2018
Chip electronic component
SAMSUNG ELECTRO MECH11 citations83
US9264010B2Feb 16, 2016
Via structure having open stub and printed circuit board having the same
SAMSUNG ELECTRO MECH9 citations83
US7557445B2Jul 7, 2009
Multilayer substrate and the manufacturing method thereof
SAMSUNG ELECTRO MECH8 citations81
US7230815B2Jun 12, 2007
Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
SAMSUNG ELECTRO MECH20 citations80
US11756724B2Sep 12, 2023
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US11443894B2Sep 13, 2022
Coil component
SAMSUNG ELECTRO MECH2 citations73
US11424065B2Aug 23, 2022
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US11170927B2Nov 9, 2021
Coil component
SAMSUNG ELECTRO MECH2 citations73
US11075030B2Jul 27, 2021
Inductor array
SAMSUNG ELECTRO MECH2 citations73
US10629365B2Apr 21, 2020
Inductor array component and board for mounting the same
SAMSUNG ELECTRO MECH2 citations73
US10607765B2Mar 31, 2020
Coil component and board having the same
SAMSUNG ELECTRO MECH4 citations73
US10559413B2Feb 11, 2020
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US9655247B1May 16, 2017
Coil component and board having the same
SAMSUNG ELECTRO MECH6 citations73
US9536660B2Jan 3, 2017
Chip electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH6 citations73
US7262675B2Aug 28, 2007
Laminated filter with improved stop band attenuation
SAMSUNG ELECTRO MECH7 citations73
US10340073B2Jul 2, 2019
Coil component and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations71
US12217896B2Feb 4, 2025
Coil component
SAMSUNG ELECTRO MECH0 citations63
US12112879B2Oct 8, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations63
US12073971B2Aug 27, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations63
SK HYNIX INC
6 patentsUS9299447B2Mar 29, 2016
3-dimensional semiconductor device having memory cells stacked over substrate
SK HYNIX INC10 citations82
US9455009B2Sep 27, 2016
Operating characteristics of a semiconductor device
SK HYNIX INC3 citations72
US9082488B2Jul 14, 2015
Flash memory device and method of programming the same
SK HYNIX INC5 citations70
US12349354B2Jul 1, 2025
Semiconductor memory device and manufacturing method thereof
SK HYNIX INC0 citations63
US12185541B2Dec 31, 2024
Semiconductor memory device of vertical channel structure and method of manufacturing the same
SK HYNIX INC0 citations63
US11963355B2Apr 16, 2024
Semiconductor memory device and manufacturing method thereof
SK HYNIX INC0 citations63
SAMSUNG DISPLAY CO LTD
4 patentsUS11599228B2Mar 7, 2023
Electronic device including a sensor for an active pen
SAMSUNG DISPLAY CO LTD7 citations84
US9460646B2Oct 4, 2016
Display device and bonding test system
SAMSUNG DISPLAY CO LTD4 citations73
US10176756B2Jan 8, 2019
Organic light emitting display device and electronic device having the same
SAMSUNG DISPLAY CO LTD5 citations72
US9786384B2Oct 10, 2017
Display device
SAMSUNG DISPLAY CO LTD5 citations72
LEE DONG HWAN
3 patentsUS8786230B2Jul 22, 2014
Apparatus and method of estimating inductance of permanent magnet synchronous motor
LEE DONG HWAN13 citations83
US9330739B2May 3, 2016
Semiconductor device having high-voltage transistor
LEE DONG HWAN4 citations73
US9875044B2Jan 23, 2018
Data storage device compensating for initial threshold voltage distribution shift, method of operating the same, and data processing system including the same
LEE DONG HWAN5 citations72
SAMSUNG ELECTRONICS CO LTD
3 patentsUS8049543B2Nov 1, 2011
Delay locked loop, electronic device including the same, and method of operating the same
SAMSUNG ELECTRONICS CO LTD8 citations78
US9438131B2Sep 6, 2016
AC-DC converter
SAMSUNG ELECTRONICS CO LTD3 citations73
US10332606B2Jun 25, 2019
Memory Controller for controlling memory device based on erase state information and method of operating the memory controller
SAMSUNG ELECTRONICS CO LTD1 citations72
LG ELECTRONICS INC
2 patentsLEE DONG-HWAN
1 patentBOE HYDIS TECHNOLOGY CO LTD
1 patentSAMSUNG SDI CO LTD
1 patentLUNA CO LTD
1 patentSL CORP
1 patentHONG SEUNG KYUN
1 patentShowing the top 50 of 137 patents by PatentIndex Score.