Inventor
YOON CHAN
KR70 patents
Patents
50 patentsUS9945042B2Apr 17, 2018
Chip electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH18 citations94
US11158455B2Oct 26, 2021
Electronic component having body with exposed lower portion
SAMSUNG ELECTRO MECH6 citations84
US10109409B2Oct 23, 2018
Chip electronic component and board for mounting thereof
SAMSUNG ELECTRO MECH8 citations84
US10079089B1Sep 18, 2018
Coil electronic component and board having the same
SAMSUNG ELECTRO MECH8 citations84
US9576711B2Feb 21, 2017
Coil component and board having the same
SAMSUNG ELECTRO MECH10 citations84
US9490062B2Nov 8, 2016
Chip electronic component
SAMSUNG ELECTRO MECH13 citations84
US9263180B2Feb 16, 2016
Coil component and board having the same
SAMSUNG ELECTRO MECH7 citations84
US11756724B2Sep 12, 2023
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US11670451B2Jun 6, 2023
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH1 citations73
US11527358B2Dec 13, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US11443894B2Sep 13, 2022
Coil component
SAMSUNG ELECTRO MECH2 citations73
US11424065B2Aug 23, 2022
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US11348727B2May 31, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH2 citations73
US11170927B2Nov 9, 2021
Coil component
SAMSUNG ELECTRO MECH2 citations73
US11075030B2Jul 27, 2021
Inductor array
SAMSUNG ELECTRO MECH2 citations73
US10957486B2Mar 23, 2021
Electronic component
SAMSUNG ELECTRO MECH3 citations73
US10629365B2Apr 21, 2020
Inductor array component and board for mounting the same
SAMSUNG ELECTRO MECH2 citations73
US10607765B2Mar 31, 2020
Coil component and board having the same
SAMSUNG ELECTRO MECH4 citations73
US10559413B2Feb 11, 2020
Coil electronic component
SAMSUNG ELECTRO MECH2 citations73
US9655247B1May 16, 2017
Coil component and board having the same
SAMSUNG ELECTRO MECH6 citations73
US9208935B2Dec 8, 2015
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10340073B2Jul 2, 2019
Coil component and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations71
US12217896B2Feb 4, 2025
Coil component
SAMSUNG ELECTRO MECH0 citations63
US12205772B2Jan 21, 2025
Multilayer capacitor and substrate including the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US12136523B2Nov 5, 2024
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US12112879B2Oct 8, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations63
US12073971B2Aug 27, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations63
US11961673B2Apr 16, 2024
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations63
US11875948B2Jan 16, 2024
Multilayer capacitor and substrate including the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US11763986B2Sep 19, 2023
Electronic component including insulating layer between body and shielding layer
SAMSUNG ELECTRO MECH0 citations63
US11651897B2May 16, 2023
Electronic component
SAMSUNG ELECTRO MECH0 citations63
US11594375B2Feb 28, 2023
Multilayer capacitor and substrate including the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US11515094B2Nov 29, 2022
Multilayer capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations63
US11295890B2Apr 5, 2022
Coil component
SAMSUNG ELECTRO MECH0 citations63
US12057249B2Aug 6, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations62
US12051535B2Jul 30, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations62
US11929200B2Mar 12, 2024
Coil component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations62
US11783982B2Oct 10, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations62
US11676759B2Jun 13, 2023
Coil component
SAMSUNG ELECTRO MECH1 citations62
US10801121B2Oct 13, 2020
Chip electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations62
US12417871B2Sep 16, 2025
Coil component
SAMSUNG ELECTRO MECH0 citations52
US12148560B2Nov 19, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations52
US12040123B2Jul 16, 2024
Coil component
SAMSUNG ELECTRO MECH0 citations52
US11664148B2May 30, 2023
Coil component
SAMSUNG ELECTRO MECH0 citations52
US11495409B2Nov 8, 2022
Multi-layered ceramic capacitor
SAMSUNG ELECTRO MECH0 citations52
US11264161B2Mar 1, 2022
Coil electronic component
SAMSUNG ELECTRO MECH0 citations52
US11183324B2Nov 23, 2021
Inductor array
SAMSUNG ELECTRO MECH0 citations52
US11087919B2Aug 10, 2021
Inductor array including coil components
SAMSUNG ELECTRO MECH0 citations52
US10957477B2Mar 23, 2021
Inductor
SAMSUNG ELECTRO MECH0 citations52
US10699839B2Jun 30, 2020
Thin film-type inductor
SAMSUNG ELECTRO MECH0 citations52
Showing the top 50 of 70 patents by PatentIndex Score.