Inventor
HINRICH ANDREAS
DE3 patents
Patents
3 patentsUS10622331B2Apr 14, 2020
Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
HERAEUS DEUTSCHLAND GMBH & CO KG2 citations66
US10347566B2Jul 9, 2019
Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
HERAEUS DEUTSCHLAND GMBH & CO KG0 citations47
US11440310B2Sep 13, 2022
Method for producing a substrate adapter and substrate adapter for connecting to an electronic component
HERAEUS DEUTSCHLAND GMBH & CO KG0 citations41