Inventor

PARK BYUNG-IYUL

KR6 patents

⚠️ This page may combine multiple inventors who share the name “PARK BYUNG-IYUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US10153219B2Dec 11, 2018

Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD52 citations93

US9698051B2Jul 4, 2017

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

SAMSUNG ELECTRONICS CO LTD3 citations72

HAN KYU-HEE

1 patent

US8426308B2Apr 23, 2013

Method of forming through silicon via of semiconductor device using low-k dielectric material

HAN KYU-HEE16 citations90

PARK JAE-HWA

1 patent

US9214411B2Dec 15, 2015

Integrated circuit devices including a through-silicon via structure and methods of fabricating the same

PARK JAE-HWA12 citations83

CHOI JU-IL

1 patent

US9735090B2Aug 15, 2017

Integrated circuit devices having through-silicon vias and methods of manufacturing such devices

CHOI JU-IL10 citations81

MOON KWANG-JIN

1 patent

US9530726B2Dec 27, 2016

Semiconductor device and method of fabricating the same

MOON KWANG-JIN2 citations61