P

Inventor

NAKAMURA HIDEFUMI

JP25 patents
⚠️ This page may combine multiple inventors who share the name “NAKAMURA HIDEFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEIKO EPSON CORP

23 patents
US10848016B2Nov 24, 2020

Magnetic powder dust core with entirely buried coil or magnet

SEIKO EPSON CORP13 citations83
US11866808B2Jan 9, 2024

Method for manufacturing thixomolding material

SEIKO EPSON CORP2 citations72
US10682697B2Jun 16, 2020

Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body

SEIKO EPSON CORP2 citations72
US10675682B2Jun 9, 2020

Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body

SEIKO EPSON CORP5 citations72
US10299376B2May 21, 2019

Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object

SEIKO EPSON CORP3 citations71
US9888987B2Feb 13, 2018

Dental blank to be machined, metal powder for powder metallurgy, dental metal frame for porcelain bonding, and dental prosthesis

SEIKO EPSON CORP2 citations71
US9249292B2Feb 2, 2016

Composition for injection molding, sintered compact, and method for producing sintered compact

SEIKO EPSON CORP3 citations69
US9954160B2Apr 24, 2018

Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object

SEIKO EPSON CORP3 citations68
US11498123B2Nov 15, 2022

Metal powder for powder metallurgy, compound, granulated powder, sintered body, and ornament

SEIKO EPSON CORP0 citations62
US11014155B2May 25, 2021

Gear, deceleration device, robot, and moving object

SEIKO EPSON CORP0 citations62
US10934607B2Mar 2, 2021

Titanium sintered body, ornament, and heat resistant component

SEIKO EPSON CORP0 citations61
US11548066B2Jan 10, 2023

Injection molding material for magnesium thixomolding

SEIKO EPSON CORP0 citations60
US9219218B2Dec 22, 2015

Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object

SEIKO EPSON CORP3 citations60
US11524337B2Dec 13, 2022

Powder for additive manufacturing, additively manufactured body, method for producing additively manufactured body, and method for producing metal sintered body

SEIKO EPSON CORP0 citations59
US11148197B2Oct 19, 2021

Raw material for thixomolding, method for producing raw material for thixomolding, and molded body

SEIKO EPSON CORP0 citations58
US11332811B2May 17, 2022

Metal powder for powder metallurgy, compound, granulated powder, and sintered body

SEIKO EPSON CORP0 citations52
US9655698B2May 23, 2017

Blank material to be cut for dentistry, metal powder for powder metallurgy, metal frame for porcelain fusing for dentistry, and dental prosthesis

SEIKO EPSON CORP1 citations52
US12240059B2Mar 4, 2025

Device for manufacturing three-dimensional shaped object and method for manufacturing three-dimensional shaped object

SEIKO EPSON CORP0 citations51
US10773302B2Sep 15, 2020

Metal powder for powder metallurgy, compound, granulated powder, and sintered body

SEIKO EPSON CORP0 citations51
US10130449B2Nov 20, 2018

Dental casting billet material, metal powder for powder metallurgy, dental metal component, and dental prosthesis

SEIKO EPSON CORP0 citations48
US9769934B2Sep 19, 2017

Package base, package, electronic device, electronic apparatus, and moving object

SEIKO EPSON CORP0 citations48
US9309383B2Apr 12, 2016

Composition for injection molding, sintered compact, and method for producing sintered compact

SEIKO EPSON CORP0 citations48
US9045632B2Jun 2, 2015

Method for producing composition for injection molding comprising cryogenic grinding of resin components, and composition for injection molding

SEIKO EPSON CORP0 citations37

ISHIGAMI HIDEKI

1 patent

NAKAMURA HIDEFUMI

1 patent