Inventor
NAKAMURA HIDEFUMI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “NAKAMURA HIDEFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
23 patentsUS10848016B2Nov 24, 2020
Magnetic powder dust core with entirely buried coil or magnet
SEIKO EPSON CORP13 citations83
US11866808B2Jan 9, 2024
Method for manufacturing thixomolding material
SEIKO EPSON CORP2 citations72
US10682697B2Jun 16, 2020
Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body
SEIKO EPSON CORP2 citations72
US10675682B2Jun 9, 2020
Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body
SEIKO EPSON CORP5 citations72
US10299376B2May 21, 2019
Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object
SEIKO EPSON CORP3 citations71
US9888987B2Feb 13, 2018
Dental blank to be machined, metal powder for powder metallurgy, dental metal frame for porcelain bonding, and dental prosthesis
SEIKO EPSON CORP2 citations71
US9249292B2Feb 2, 2016
Composition for injection molding, sintered compact, and method for producing sintered compact
SEIKO EPSON CORP3 citations69
US9954160B2Apr 24, 2018
Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object
SEIKO EPSON CORP3 citations68
US11498123B2Nov 15, 2022
Metal powder for powder metallurgy, compound, granulated powder, sintered body, and ornament
SEIKO EPSON CORP0 citations62
US11014155B2May 25, 2021
Gear, deceleration device, robot, and moving object
SEIKO EPSON CORP0 citations62
US10934607B2Mar 2, 2021
Titanium sintered body, ornament, and heat resistant component
SEIKO EPSON CORP0 citations61
US11548066B2Jan 10, 2023
Injection molding material for magnesium thixomolding
SEIKO EPSON CORP0 citations60
US9219218B2Dec 22, 2015
Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object
SEIKO EPSON CORP3 citations60
US11524337B2Dec 13, 2022
Powder for additive manufacturing, additively manufactured body, method for producing additively manufactured body, and method for producing metal sintered body
SEIKO EPSON CORP0 citations59
US11148197B2Oct 19, 2021
Raw material for thixomolding, method for producing raw material for thixomolding, and molded body
SEIKO EPSON CORP0 citations58
US11332811B2May 17, 2022
Metal powder for powder metallurgy, compound, granulated powder, and sintered body
SEIKO EPSON CORP0 citations52
US9655698B2May 23, 2017
Blank material to be cut for dentistry, metal powder for powder metallurgy, metal frame for porcelain fusing for dentistry, and dental prosthesis
SEIKO EPSON CORP1 citations52
US12240059B2Mar 4, 2025
Device for manufacturing three-dimensional shaped object and method for manufacturing three-dimensional shaped object
SEIKO EPSON CORP0 citations51
US10773302B2Sep 15, 2020
Metal powder for powder metallurgy, compound, granulated powder, and sintered body
SEIKO EPSON CORP0 citations51
US10130449B2Nov 20, 2018
Dental casting billet material, metal powder for powder metallurgy, dental metal component, and dental prosthesis
SEIKO EPSON CORP0 citations48
US9769934B2Sep 19, 2017
Package base, package, electronic device, electronic apparatus, and moving object
SEIKO EPSON CORP0 citations48
US9309383B2Apr 12, 2016
Composition for injection molding, sintered compact, and method for producing sintered compact
SEIKO EPSON CORP0 citations48
US9045632B2Jun 2, 2015
Method for producing composition for injection molding comprising cryogenic grinding of resin components, and composition for injection molding
SEIKO EPSON CORP0 citations37