Inventor
HIDESHIMA YASUTOSHI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “HIDESHIMA YASUTOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
14 patentsUS11866808B2Jan 9, 2024
Method for manufacturing thixomolding material
SEIKO EPSON CORP2 citations72
US10682697B2Jun 16, 2020
Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body
SEIKO EPSON CORP2 citations72
US10675682B2Jun 9, 2020
Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body
SEIKO EPSON CORP5 citations72
US11865609B2Jan 9, 2024
Method for manufacturing powder-modified magnesium alloy chip
SEIKO EPSON CORP2 citations71
US11235391B2Feb 1, 2022
Device for manufacturing three-dimensional shaped object and method for manufacturing three-dimensional shaped object
SEIKO EPSON CORP0 citations61
US11548066B2Jan 10, 2023
Injection molding material for magnesium thixomolding
SEIKO EPSON CORP0 citations60
US12521790B2Jan 13, 2026
Thixomolding material
SEIKO EPSON CORP0 citations59
US12479021B2Nov 25, 2025
Thixomolding material and method of manufacturing thixomolding material
SEIKO EPSON CORP0 citations59
US12311437B2May 27, 2025
Thixomolding material
SEIKO EPSON CORP0 citations59
US11878345B2Jan 23, 2024
Thixomolding material
SEIKO EPSON CORP0 citations59
US11148197B2Oct 19, 2021
Raw material for thixomolding, method for producing raw material for thixomolding, and molded body
SEIKO EPSON CORP0 citations58
US12240059B2Mar 4, 2025
Device for manufacturing three-dimensional shaped object and method for manufacturing three-dimensional shaped object
SEIKO EPSON CORP0 citations51
US11420371B2Aug 23, 2022
Material plasticizing device
SEIKO EPSON CORP0 citations50
US11230059B2Jan 25, 2022
Plasticizing device and three dimensional modeling apparatus
SEIKO EPSON CORP0 citations50