Inventor
DE BINOD B
US27 patents
⚠️ This page may combine multiple inventors who share the name “DE BINOD B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJIFILM ELECTRONIC MAT USA INC
16 patentsUS9617386B2Apr 11, 2017
Process for the production of polyimide and polyamic ester polymers
FUJIFILM ELECTRONIC MAT USA INC4 citations83
US11899364B2Feb 13, 2024
Photosensitive polyimide compositions
FUJIFILM ELECTRONIC MAT USA INC1 citations72
US10604628B2Mar 31, 2020
Polymer and thermosetting composition containing same
FUJIFILM ELECTRONIC MAT USA INC2 citations72
US10563014B2Feb 18, 2020
Dielectric film forming composition
FUJIFILM ELECTRONIC MAT USA INC3 citations72
US10036952B2Jul 31, 2018
Photosensitive polyimide compositions
FUJIFILM ELECTRONIC MAT USA INC4 citations72
US9695284B2Jul 4, 2017
Polymer and thermosetting composition containing same
FUJIFILM ELECTRONIC MAT USA INC3 citations72
US10781341B2Sep 22, 2020
Polyimide compositions
FUJIFILM ELECTRONIC MAT USA INC2 citations71
US11782344B2Oct 10, 2023
Photosensitive polyimide compositions
FUJIFILM ELECTRONIC MAT USA INC0 citations62
US11175582B2Nov 16, 2021
Photosensitive stacked structure
FUJIFILM ELECTRONIC MAT USA INC0 citations62
US12338309B2Jun 24, 2025
Dielectric film-forming composition
FUJIFILM ELECTRONIC MAT USA INC0 citations61
US11945894B2Apr 2, 2024
Dielectric film-forming composition
FUJIFILM ELECTRONIC MAT USA INC0 citations61
US11939428B2Mar 26, 2024
Polyimides
FUJIFILM ELECTRONIC MAT USA INC0 citations51
US11061327B2Jul 13, 2021
Polyimides
FUJIFILM ELECTRONIC MAT USA INC0 citations51
US10696932B2Jun 30, 2020
Cleaning composition
FUJIFILM ELECTRONIC MAT USA INC0 citations51
US9777117B2Oct 3, 2017
Process for the production of polyimide and polyamic ester polymers
FUJIFILM ELECTRONIC MAT USA INC0 citations51
US10793676B2Oct 6, 2020
Polyimides
FUJIFILM ELECTRONIC MAT USA INC0 citations41
ARCH SPEC CHEM INC
4 patentsUS6916543B2Jul 12, 2005
Copolymer, photoresist compositions thereof and deep UV bilayer system thereof
ARCH SPEC CHEM INC28 citations90
US6610808B2Aug 26, 2003
Thermally cured underlayer for lithographic application
ARCH SPEC CHEM INC28 citations90
US6924339B2Aug 2, 2005
Thermally cured underlayer for lithographic application
ARCH SPEC CHEM INC12 citations82
US6929897B2Aug 16, 2005
Photosensitive bilayer composition
ARCH SPEC CHEM INC7 citations71