Inventor
GOH KOH HOO
MY3 patents
Patents
3 patentsUS8049311B2Nov 1, 2011
Electronic component and method for its production
INFINEON TECHNOLOGIES AG8 citations77
US7615410B2Nov 10, 2009
Chip-sized flip-chip semiconductor package and method for making the same
INFINEON TECHNOLOGIES AG5 citations56
US7432584B2Oct 7, 2008
Leadframe for use in a semiconductor package
INFINEON TECHNOLOGIES AG4 citations54