Inventor

CHIA LAI YEE

SG6 patents

⚠️ This page may combine multiple inventors who share the name “CHIA LAI YEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

3 patents

US9184104B1Nov 10, 2015

Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant

STATS CHIPPAC LTD17 citations81

US9768066B2Sep 19, 2017

Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation

STATS CHIPPAC LTD0 citations50

US9257382B2Feb 9, 2016

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

STATS CHIPPAC LTD0 citations48

NA DUK JU

1 patent

US8558389B2Oct 15, 2013

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

NA DUK JU5 citations75

STATS CHIPPAC PTE LTD

1 patent

US10553487B2Feb 4, 2020

Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation

STATS CHIPPAC PTE LTD4 citations71

SHARIFF DZAFIR

1 patent

US9824923B2Nov 21, 2017

Semiconductor device and method of forming conductive pillar having an expanded base

SHARIFF DZAFIR4 citations58