Inventor
CHUNG CHRIS
US21 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG CHRIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLE INC
8 patentsUS12149699B2Nov 19, 2024
Content adaptation for streaming
APPLE INC3 citations75
US11093752B2Aug 17, 2021
Object tracking in multi-view video
APPLE INC5 citations73
US10757428B2Aug 25, 2020
Luma and chroma reshaping of HDR video encoding
APPLE INC4 citations73
US11166027B2Nov 2, 2021
Content adaptation for streaming
APPLE INC0 citations62
US10178394B2Jan 8, 2019
Transcoding techniques for alternate displays
APPLE INC1 citations62
US10402677B2Sep 3, 2019
Hierarchical sharpness evaluation
APPLE INC1 citations61
US10873763B2Dec 22, 2020
Video compression techniques for high dynamic range data
APPLE INC0 citations52
US10070143B2Sep 4, 2018
Bit stream switching in lossy network
APPLE INC0 citations51
AVAGO TECHNOLOGIES GENERAL IP
6 patentsUS9693445B2Jun 27, 2017
Printed circuit board with thermal via
AVAGO TECHNOLOGIES GENERAL IP7 citations82
US9151778B2Oct 6, 2015
Semiconductor device test socket
AVAGO TECHNOLOGIES GENERAL IP3 citations62
US9072168B2Jun 30, 2015
Electromagnetic interference blocking device and circuit assembly including the same
AVAGO TECHNOLOGIES GENERAL IP2 citations62
US9062968B2Jun 23, 2015
PCB loading apparatus for measuring thickness of printed circuit board stack
AVAGO TECHNOLOGIES GENERAL IP0 citations52
US9192048B1Nov 17, 2015
Bonding pad for printed circuit board and semiconductor chip package using same
AVAGO TECHNOLOGIES GENERAL IP0 citations51
US10021790B2Jul 10, 2018
Module with internal wire fence shielding
AVAGO TECHNOLOGIES GENERAL IP0 citations40
AVAGO TECH INT SALES PTE LID
6 patentsUS12113032B2Oct 8, 2024
Substrate having undercut portion for stress mitigation
AVAGO TECH INT SALES PTE LID0 citations60
US11276650B2Mar 15, 2022
Stress mitigation structure
AVAGO TECH INT SALES PTE LID0 citations60
US12002741B2Jun 4, 2024
Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths
AVAGO TECH INT SALES PTE LID0 citations59
US12412834B2Sep 9, 2025
Triple-sided module
AVAGO TECH INT SALES PTE LID0 citations58
US12489042B2Dec 2, 2025
Device having solder bump structure for improved mechanical, electrical, and/or thermal performance
AVAGO TECH INT SALES PTE LID0 citations57
US11610738B2Mar 21, 2023
Low profile passive components and devices and packages including the same
AVAGO TECH INT SALES PTE LID0 citations48