P

Inventor

HUANG SHIH-WEN

TW33 patents
⚠️ This page may combine multiple inventors who share the name “HUANG SHIH-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

23 patents
US9881918B1Jan 30, 2018

Forming doped regions in semiconductor strips

TAIWAN SEMICONDUCTOR MFG CO LTD27 citations93
US12087834B2Sep 10, 2024

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10629693B2Apr 21, 2020

Semiconductor structure with barrier layer and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269796B2Apr 23, 2019

Forming doped regions in semiconductor strips

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11183399B2Nov 23, 2021

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10777466B2Sep 15, 2020

Semiconductor Fin cutting process and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US10008367B2Jun 26, 2018

Gas diffuser unit, process chamber and wafer processing method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US11296198B2Apr 5, 2022

Semiconductor structure with barrier layer and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12394602B2Aug 19, 2025

Wafer processing method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11990375B2May 21, 2024

Semiconductor Fin cutting process and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11380593B2Jul 5, 2022

Semiconductor fin cutting process and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11101140B2Aug 24, 2021

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11049945B2Jun 29, 2021

Semiconductor device structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10276677B2Apr 30, 2019

Semiconductor device structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12593672B2Mar 31, 2026

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10262939B2Apr 16, 2019

Configurable routing for packaging applications

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9627223B2Apr 18, 2017

Methods and apparatus of packaging with interposers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9530730B2Dec 27, 2016

Configurable routing for packaging applications

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10720430B2Jul 21, 2020

Forming doped regions in semiconductor strips

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10522541B2Dec 31, 2019

Forming doped regions in semiconductor strips

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9711478B2Jul 18, 2017

Semiconductor device with an anti-pad peeling structure and associated method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US10741366B2Aug 11, 2020

Process chamber and wafer processing method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9978637B2May 22, 2018

Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42

UNIV FLORIDA

5 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

UNIV FLORDIA

1 patent

UNIVERISTY OF FLORIDA

1 patent

HUANG SHIH-WEN

1 patent