Inventor
HSIEH TSUNG-YANG
TW9 patents
Patents
9 patentsUS11315860B2Apr 26, 2022
Semiconductor package and manufacturing process thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations80
US11183399B2Nov 23, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12424558B2Sep 23, 2025
Bridge die having different surface orientation than IC dies interconnected by the bridge die
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11101140B2Aug 24, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11742276B2Aug 29, 2023
Semiconductor package and manufacturing process thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12519021B2Jan 6, 2026
Semiconductor package including test line structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12463099B2Nov 4, 2025
Semiconductor package including test line structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11973040B2Apr 30, 2024
Interposer with warpage-relief trenches
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12261133B2Mar 25, 2025
Interposer with warpage-relief trenches
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56