Inventor
KULKARNI DEVDATTA P
US17 patents
⚠️ This page may combine multiple inventors who share the name “KULKARNI DEVDATTA P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS10228735B2Mar 12, 2019
Methods of direct cooling of packaged devices and structures formed thereby
INTEL CORP18 citations85
US10168749B2Jan 1, 2019
Cooling using adjustable thermal coupling
INTEL CORP8 citations82
US11026351B2Jun 1, 2021
Computing apparatus with closed cooling loop
INTEL CORP2 citations72
US10727160B2Jul 28, 2020
Thermal management component
INTEL CORP3 citations72
US10074591B1Sep 11, 2018
System with provision of a thermal interface to a printed circuit board
INTEL CORP4 citations72
US10945353B2Mar 9, 2021
Mechanism with folded wrapping to seal components immersed in coolant
INTEL CORP4 citations69
US11249522B2Feb 15, 2022
Heat transfer apparatus for a computer environment
INTEL CORP4 citations68
US9983641B2May 29, 2018
Tunable two phase liquid cooling thermal management method and apparatus
INTEL CORP5 citations68
US12133368B2Oct 29, 2024
Cooling mass and spring element for low insertion force hot swappable electronic component interface
INTEL CORP0 citations60
US12093092B2Sep 17, 2024
Heat transfer apparatus for a computer environment
INTEL CORP0 citations58
US10455731B2Oct 22, 2019
Hydraulic bladder for CPU interconnection and cooling
INTEL CORP0 citations50
US10765039B2Sep 1, 2020
Two-phase liquid-vapor computer cooling device
INTEL CORP0 citations38