Inventor

YIN HONGCHENG

CN3 patents

Patents

3 patents

US11489247B2Nov 1, 2022

Integrated circuit and terminal device

HUAWEI TECH CO LTD3 citations67

US11462817B2Oct 4, 2022

Packaging structure

HUAWEI TECH CO LTD0 citations57

US11251136B2Feb 15, 2022

Flip-chip die package structure and electronic device

HUAWEI TECH CO LTD0 citations55