Inventor
KO YOUNG GWAN
KR83 patents
⚠️ This page may combine multiple inventors who share the name “KO YOUNG GWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
28 patentsUS10109588B2Oct 23, 2018
Electronic component package and package-on-package structure including the same
SAMSUNG ELECTRO MECH94 citations98
US10026668B1Jul 17, 2018
Passivation layer having an opening for under bump metallurgy
SAMSUNG ELECTRO MECH26 citations94
US10170386B2Jan 1, 2019
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH40 citations93
US10256200B2Apr 9, 2019
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations84
US10199337B2Feb 5, 2019
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH9 citations84
US10062652B2Aug 28, 2018
Fan-out semiconductor package and method of manufacturing same
SAMSUNG ELECTRO MECH12 citations84
US9984979B2May 29, 2018
Fan-out semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH10 citations84
US9741630B2Aug 22, 2017
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations84
US9842789B2Dec 12, 2017
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations83
US9832866B2Nov 28, 2017
Multilayered substrate and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations82
US10811328B1Oct 20, 2020
Semiconductor package
SAMSUNG ELECTRO MECH4 citations73
US10362667B2Jul 23, 2019
Circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH4 citations73
US10262949B2Apr 16, 2019
Fan-out semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US10045444B2Aug 7, 2018
Printed circuit board, package and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US10002811B2Jun 19, 2018
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations73
US9999131B2Jun 12, 2018
Printed circuit board with embedded electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH6 citations73
US9837343B2Dec 5, 2017
Chip embedded substrate
SAMSUNG ELECTRO MECH5 citations73
US9832856B2Nov 28, 2017
Circuit board
SAMSUNG ELECTRO MECH3 citations73
US9655229B2May 16, 2017
Circuit board
SAMSUNG ELECTRO MECH2 citations73
US9578749B2Feb 21, 2017
Element embedded printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US10306778B2May 28, 2019
Printed circuit board with dam around cavity and manufacturing method thereof
SAMSUNG ELECTRO MECH3 citations72
US10211136B2Feb 19, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH1 citations72
US10115648B2Oct 30, 2018
Fan-out semiconductor package and electronic device including the same
SAMSUNG ELECTRO MECH2 citations72
US10102964B2Oct 16, 2018
Coil electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH2 citations72
US9736927B2Aug 15, 2017
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations72
US9736939B2Aug 15, 2017
Printed circuit board and method of manufacturing printed circuit board
SAMSUNG ELECTRO MECH3 citations72
US9699885B2Jul 4, 2017
Circuit board including heat dissipation structure
SAMSUNG ELECTRO MECH2 citations72
US9793250B2Oct 17, 2017
Package board, method for manufacturing the same and package on package having the same
SAMSUNG ELECTRO MECH3 citations71
SAMSUNG ELECTRONICS CO LTD
19 patentsUS10727212B2Jul 28, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD36 citations94
US10665535B2May 26, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD17 citations93
US10403579B2Sep 3, 2019
Semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US10446478B2Oct 15, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD12 citations82
US11676907B2Jun 13, 2023
Semiconductor package and antenna module comprising the same
SAMSUNG ELECTRONICS CO LTD4 citations74
US10475748B2Nov 12, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations73
US10410961B2Sep 10, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US10388614B2Aug 20, 2019
Fan-out semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD4 citations73
US11189552B2Nov 30, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11158579B2Oct 26, 2021
Semiconductor package including a backside redistribution layer
SAMSUNG ELECTRONICS CO LTD2 citations72
US11062999B2Jul 13, 2021
Semiconductor package and antenna module comprising the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US10985127B2Apr 20, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations72
US10573613B2Feb 25, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations72
US10522497B2Dec 31, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations72
US10522451B2Dec 31, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10438884B2Oct 8, 2019
Carrier substrate and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10916495B2Feb 9, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US10796997B2Oct 6, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10475776B2Nov 12, 2019
Fan-out semiconductor package module
SAMSUNG ELECTRONICS CO LTD2 citations71
KO YOUNG GWAN
3 patentsShowing the top 50 of 83 patents by PatentIndex Score.