Inventor

LENG YAOJIAN

US60 patents

⚠️ This page may combine multiple inventors who share the name “LENG YAOJIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LENG YAOJIAN

MICROCHIP TECH INC

Manufacturing a damascene thin-film resistor

Metal-insulator-metal (MIM) capacitor and thin-film resistor (TFR) formed in an integrated circuit structure

Metal-insulator-metal (MIM) capacitor module with dielectric sidewall spacer

Metal-insulator-metal (MIM) capacitor module including a cup-shaped structure with a rounded corner region

Metal-insulator-metal (MIM) capacitor module

Techniques for making integrated inductors and related semiconductor devices, electronic systems, and methods

Three-dimensional metal-insulator-metal (MIM) capacitor

Thin-film resistor (TFR) module with top-side interconnects connected to reduced TFR ridges and manufacturing methods

Thin-film resistor (TFR) formed under a metal layer and method of fabrication

Integrated thermocouple

Integrated inductor with a stacked metal wire

Thin-film resistor (TFR) module including a TFR element formed in a metal cup structure

Method of forming an integrated circuit structure including a resistive random access memory (RRAM) cell

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Monitoring copper corrosion in an integrated circuit device

Resistive random access memory (RRAM) cells and methods of construction

Thin-film resistor (TFR) with displacement-plated TFR heads

Thin-film resistor (TFR) having a TFR element providing a diffusion barrier for underlying TFR heads

Method of forming a metal-insulator-metal (MIM) capacitor

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrate

Three-dimensional metal-insulator-metal (MIM) capacitor

Integrated inductor with a stacked metal wire

Thin-film resistor (TFR) module

Systems and methods for monitoring copper corrosion in an integrated circuit device

Metal-insulator-metal (MIM) capacitor

Method of manufacturing damascene thin-film resistor (TFR) in poly-metal dielectric

Integrated circuit package module including a bonding system

Integrated circuit bond pad with multi-material toothed structure

Integrated circuit bond pad with multi-material toothed structure

Metal-insulator-metal (MIM) capacitors with curved electrode

Forming a partially silicided element

Integrated inductor including multi-component via layer inductor element

Multi-capacitor module including a stacked metal-insulator-metal (MIM) structure

Multi-capacitor module including a nested metal-insulator-metal (MIM) structure

Integrated circuit structure including a metal-insulator-metal (MIM) capacitor module and a thin-film resistor (TFR) module

Metal-insulator-metal (MIM) capacitor module with outer electrode extension

Integrated inductor with inductor wire formed in an integrated circuit layer stack

Metal-insulator-metal (MIM) capacitor including an insulator cup and laterally-extending insulator flange

Ferroelectric random access memory (FRAM) capacitors and methods of construction

TEXAS INSTRUMENTS INC

CMP in-situ conditioning with pad and retaining ring clean

In-situ randomization and recording of wafer processing order at process tools

Method for evaluating process chambers used for semiconductor manufacturing

Corrosion resistance for copper interconnects

In-situ randomization and recording of wafer processing order at process tools

In-situ randomization and recording of wafer processing order at process tools

Shallow trench isolation step height detection method

Chemical mechanical polishing pad having improved groove pattern

NAT SEMICONDUCTOR CORP

Method for eliminating a mask layer during thin film resistor manufacturing

NAT SEMICONDUCTOR CORPORATION

Trench DMOS transistor with reduced gate-to-drain capacitance