Inventor
CHEN YU-HAO
TW40 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YU-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
25 patentsUS11967591B2Apr 23, 2024
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11688725B2Jun 27, 2023
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11609374B2Mar 21, 2023
Directionally tunable optical reflector
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11233039B2Jan 25, 2022
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US12566302B2Mar 3, 2026
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368148B2Jul 22, 2025
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12360321B2Jul 15, 2025
Package structure, semiconductor device and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300684B2May 13, 2025
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12271029B2Apr 8, 2025
Directionally tunable optical reflector
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12197123B2Jan 14, 2025
Methods for making semiconductor-based integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12181722B2Dec 31, 2024
Structures and process flow for integrated photonic-electric ic package by using polymer waveguide
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12159791B2Dec 3, 2024
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12085769B2Sep 10, 2024
Integrated circuit device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12074148B2Aug 27, 2024
Heat dissipation in semiconductor packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11994713B2May 28, 2024
Directionally tunable optical reflector
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11852967B2Dec 26, 2023
Methods for making semiconductor-based integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817324B2Nov 14, 2023
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11754794B2Sep 12, 2023
Semiconductor device including optical through via and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11740415B2Aug 29, 2023
Structures and process flow for integrated photonic-electric IC package by using polymer waveguide
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527518B2Dec 13, 2022
Heat dissipation in semiconductor packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12512419B2Dec 30, 2025
Method of fabricating memory device and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218082B2Feb 4, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11855006B2Dec 26, 2023
Memory device, package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12055800B2Aug 6, 2024
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12029123B2Jul 2, 2024
Semiconductor structure and method of manufacturing a semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
MPI CORP
5 patentsUS11346860B2May 31, 2022
Probe head for high frequency signal test and medium or low frequency signal test at the same time
MPI CORP0 citations49
US11774468B2Oct 3, 2023
Vertical probe head
MPI CORP0 citations47
US12392803B2Aug 19, 2025
Probe card, method for designing probe card, method for producing tested semiconductor device method for testing unpackaged semiconductor by probe card, device under test and probe system
MPI CORP0 citations46
US10101362B2Oct 16, 2018
Probe module with high stability
MPI CORP0 citations41
US10753960B2Aug 25, 2020
Probe card and signal path switching module assembly
MPI CORP0 citations32