Inventor
LEE JYH CHWEN FRANK
US16 patents
⚠️ This page may combine multiple inventors who share the name “LEE JYH CHWEN FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS11967591B2Apr 23, 2024
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations74
US11842946B2Dec 12, 2023
Semiconductor package having an encapsulant comprising conductive fillers and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12400989B2Aug 26, 2025
Arrangement of power-grounds in package structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368148B2Jul 22, 2025
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12159791B2Dec 3, 2024
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12074148B2Aug 27, 2024
Heat dissipation in semiconductor packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11929340B2Mar 12, 2024
Arrangement of power-grounds in package structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11817324B2Nov 14, 2023
Info packages including thermal dissipation blocks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527518B2Dec 13, 2022
Heat dissipation in semiconductor packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261095B2Mar 25, 2025
Semiconductor package having an encapulant comprising conductive fillers and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12525578B2Jan 13, 2026
Thermally-aware semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12299369B2May 13, 2025
Systems and methods of estimating thermal properties of semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12512445B2Dec 30, 2025
Package structure, semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50