Inventor

OKAYAMA YOSHIO

JP50 patents

⚠️ This page may combine multiple inventors who share the name “OKAYAMA YOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKAYAMA YOSHIO

SANYO ELECTRIC CO

Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device

Semiconductor device with via hole for electric connection

Semiconductor device and manufacturing method thereof

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Fabrication method of semiconductor device and abrasive liquid used therein

Manufacturing method of semiconductor device with a barrier layer and a metal layer

Semiconductor device with a barrier layer and a metal layer

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Method of fabricating semiconductor device having alignment mark

Chucking method and processing method using the same

Method of manufacturing semiconductor device

Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board

Semiconductor module manufacturing method, semiconductor module, and mobile device

Semiconductor device with via hole of uneven width

Semiconductor device with reduced short circuiting between gate electrode and source/drain region

Method of manufacturing a semiconductor device

Semiconductor device and method for manufacturing thereof

Device mounting board and semiconductor power module

Method for manufacturing a circuit device

Semiconductor module, method for manufacturing semiconductor module, and portable device

PANASONIC IP MAN CO LTD

Power semiconductor device to reduce voltage variation between terminals

RAMO4 monocrystalline substrate

Group III nitride substrate and method for producing group III nitride crystal

RAMO4 substrate and manufacturing method thereof

RAMO4 substrate

RAMO4 substrate and manufacturing method thereof

Method for producing group III nitride crystal

Light emitting device, manufacturing method therefor, and waveguide structure

Method of manufacture of group III nitride semiconductor

UNIV OSAKA

Production method for group III nitride crystal

Method of manufacturing group III nitride crystal by reacting an oxidizing gas containing nitrogen with a group III element droplet and growing a group III nitride crystal on a seed substrate

Group-III nitride substrate containing carbon at a surface region thereof

Process for producing group III nitride crystal and apparatus for producing group III nitride crystal

Method of manufacturing a group III-nitride crystal comprising a nucleation step, a pyramid growth step, a lateral growth step, and a flat thick film growth step

PANASONIC CORP

Group-III nitride substrate

Group III nitride crystal, group III nitride substrate, and method of manufacturing group III nitride crystal

Group III nitride crystal, group III nitride substrate, and method of manufacturing group III nitride crystal

Method for producing group III nitride crystal and seed substrate

OKAYAMA YOSHIO

Semiconductor laser device, optical pickup device and semiconductor device

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

YANASE YASUYUKI

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Semiconductor module

SAITOU KOUICHI

Method for producing substrate for mounting device and method for producing a semiconductor module

Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween

KOBAYASHI HAJIME

Device mounting board and manufacturing method therefor, and semiconductor module

KAMEYAMA KOUJIRO

Semiconductor device and manufacturing method of the same

UMEMOTO MITSUO

Manufacturing method of semiconductor device

PANASONIC HOLDINGS CORP

Group-III nitride substrate

KAMEYAMA KOJIRO

Method of manufacturing semiconductor device with through hole

YAMAMOTO TETSUYA

Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device