Inventor

ZHANG CHONG

US99 patents

⚠️ This page may combine multiple inventors who share the name “ZHANG CHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHANG CHONG

INTEL CORP

Interconnect structures for embedded bridge

Package substrate with high density interconnect design to capture conductive features on embedded die

Microelectronic assemblies having an integrated capacitor

Microelectronic assemblies having a cooling channel

Phase change material in substrate cavity

Package with bi-layered dielectric structure

Microelectronic assemblies having an integrated capacitor

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Electronic device including a lateral trace

Metal protected fan-out cavity

Asymmetric cored integrated circuit package supports

Microelectronic assemblies having an integrated capacitor

Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate

Package including fully integrated voltage regulator circuitry within a substrate

Techniques for an inductor at a first level interface

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Techniques for an inductor at a second level interface

Semiconductor package substrate with through-hole magnetic core inductor using conductive paste

Techniques for an inductor at a second level interface

Patternable die attach materials and processes for patterning

AYAR LABS INC

Multi-chip packaging of silicon photonics

Vertical integrated photonics chiplet for in-package optical interconnect

Hybrid multi-wavelength source and associated methods

Hybrid multi-wavelength source and associated methods

Systems and methods for passively-aligned optical waveguide edge-coupling

ZHANG CHONG

Heterogeneously integrated photonic devices with improved optical coupling between waveguides

Integrated active devices with enhanced optical coupling to dielectric waveguides

Multiband antenna

Laser cavity formation for embedded dies or components in substrate build-up layers

Integrated GaAs active devices with improved optical coupling to dielectric waveguides

HUAWEI TECH CO LTD

Audio output method, electronic device, and storage medium

Audio output method, electronic device, and storage medium

HEWLETT PACKARD ENTPR DEV LP

Quantum-dot-based avalanche photodiodes on silicon

Laser

QINGDAO QIYUAN CXINKEJI CO LTD

Underwater robot

Sealing device and underwater machinery equipment

UNIV CENTRAL FLORIDA RES FOUND

Laser beam shaping for pitchfork profile

SHENZHEN THANKSHOME TECH CO LTD

LED light panel

SHANGHAI MIMENG NETWORK TECH CO LTD

Pet water bottle

HONGFUJIN PREC IND SHENZHEN

Dual-mode antenna device

PARK HYUNDAI

Active-passive photonic integrated circuit platform

TAHOE RES LTD

Electronic device including a lateral trace

TRIPLE WIN TECH SHENZHEN CO LTD

Peeling device

NEXUS PHOTONICS INC

Heterogeneous photonic integrated circuits with doped waveguides

UNIV DALIAN TECH

Vertical-edge double-step sawtooth cutter for preparing high-quality holes of composite material and hybrid stack structure thereof

UNIV SOUTH CHINA

Electrokinetic device and method for in-situ leaching of uranium

KOMLJENOVIC TIN

Mode control in heterogeneously integrated photonics

BOE TECHNOLOGY GROUP CO LTD

Adjustable frame and foldable display device

HONOR DEVICE CO LTD

Audio output method, electronic device, and storage medium

LI PING

Dual-band antenna