Inventor

LEE TAEWOO

KR114 patents

⚠️ This page may combine multiple inventors who share the name “LEE TAEWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE TAEWOO

SHARP KK

User equipments, base stations, and methods

User equipment, base station, method for a user equipment, and method for a base station

User equipments, base stations, and methods

Base stations and methods

Base stations and methods

Terminal apparatus, base station apparatus, and communication method

Terminal device, base station device, and method

Terminal apparatus, base station apparatus, and communication method

Terminal apparatus, base station apparatus, and communication method

Terminal apparatus, base station apparatus, communication method, and integrated circuit

Terminal apparatus, base station apparatus, and communication method with beam parameters including quasi co-located antenna port indexes

Terminal apparatus and method

Terminal apparatus and method

Terminal apparatus, base station apparatus and communication method

User equipment, base station device, and communication method for DCI-based resource allocation

Terminal apparatus and communication method

Terminal apparatus, base station apparatus, and communication method

Terminal devices, base station devices, and communication methods

Terminal apparatus and communication method

Base station apparatus, terminal apparatus, and method for a random access procedure in wireless communication

User equipments, base stations, and methods

Terminal apparatus, base station apparatus, and communication method

Terminal devices, base station devices, and communication methods

Terminal apparatus, base station apparatus, and communication method

Terminal apparatus, base station apparatus, and communication method using multiple downlink control information formats to schedule multiple physical downlink shared channels

Base station apparatus, and communication method for PUCCH resource selection

Terminal apparatus, base station apparatus, and communication method

Terminal apparatus, base station apparatus, and communication method

STATS CHIPPAC LTD

Grooving bumped wafer pre-underfill system

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Package-on-package system with via Z-interconnections

Grooving bumped wafer pre-underfill system

POSTECH ACAD IND FOUND

Wavelength converting particle, method for manufacturing wavelength converting particle, and light emitting diode containing wavelength converting particle

Perovskite light emitting device containing exciton buffer layer and method for manufacturing same

Core-shell structured perovskite particle light-emitter, method of preparing the same and light emitting device using the same

Perovskite nanocrystal particle light-emitter whose content is changed, method of producing the same, and light emitting element using the same

CHOI DAESIK

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

SEAGATE TECHNOLOGY LLC

Heat-assisted magnetic recording head with constant-width gap between near-field transducer and side shield

Near-field transducer having a peg surrounded by a metal aperture plate

HYUNDAI MOTOR CO LTD

Vehicle having controller for managing battery and method for the same

Vehicle and method of controlling the same

MOON DONGSOO

Integrated circuit packaging system with interconnect and method of manufacture thereof

LEE JAEHYUN

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

CHO SUNGWON

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

LG ELECTRONICS INC

Electronic device for zooming a preview image

BIONEER CORP

Pharmaceutical composition for treating cancer comprising microrna as active ingredient

POSTECH ACADEMY—INDUSTRY FOUND

Integrated conductive substrate, and electronic device employing same

CHI HEEJO

Integrated circuit packaging system with an interposer and method of manufacture thereof