Inventor
HUH KYOUNGLL
KR2 patents
Patents
2 patentsUS10068877B2Sep 4, 2018
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure
STATS CHIPPAC LTD3 citations68
US9349616B2May 24, 2016
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure
STATS CHIPPAC LTD1 citations48