Inventor
SAKATA KEN
JP4 patents
Patents
4 patentsUS7255919B2Aug 14, 2007
Mold release layer transferring film and laminate film
MITSUI MINING & SMELTING CO111 citations96
US7173322B2Feb 6, 2007
COF flexible printed wiring board and method of producing the wiring board
MITSUI MINING & SMELTING CO93 citations96
US6900989B2May 31, 2005
Flexible printed wiring board with semiconductor chip and releasing layer
MITSUI MINING & SMELTING CO18 citations89
US7198989B2Apr 3, 2007
Method of producing a COF flexible printed wiring board
MITSUI MINING & SMELTING CO8 citations72